W-band micromachined vertical interconnection for three-dimensional microwave ICs

Katherine J. Henick; Jong Gwan Yook; Stephen V. Robertson; Gabriel M. Rebeiz; Linda P.B. Katehi

doi:10.1109/EUMA.1999.338477

W-band micromachined vertical interconnection for three-dimensional microwave ICs

Katherine J. Henick, Jong Gwan Yook, Stephen V. Robertson, Gabriel M. Rebeiz, Linda P.B. Katehi

Research output: Contribution to conference › Paper › peer-review

14 Citations (Scopus)

Abstract

A novel vertical interconnection utilizing finite ground coplanar waveguide (FGCPW) and silicon micromachining has been developed for W-band The measured results indicate insertion loss of only 0.6 dB. This transition uses standard processing techniques and is a compact, 520 ¿m width and 520 ¿m length, design. With this vertical interconnect, multiple IC layers may be connected to achieve new levels of high density, low loss integration.

Original language	English
Pages	402-406
Number of pages	5
DOIs	https://doi.org/10.1109/EUMA.1999.338477
Publication status	Published - 1999
Event	1999 29th European Microwave Conference, EuMC 1999 - Munich, Germany Duration: 1999 Oct 5 → 1999 Oct 7

Other

Other	1999 29th European Microwave Conference, EuMC 1999
Country/Territory	Germany
City	Munich
Period	99/10/5 → 99/10/7

All Science Journal Classification (ASJC) codes

Computer Networks and Communications
Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/EUMA.1999.338477

Cite this

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abstract = "A novel vertical interconnection utilizing finite ground coplanar waveguide (FGCPW) and silicon micromachining has been developed for W-band The measured results indicate insertion loss of only 0.6 dB. This transition uses standard processing techniques and is a compact, 520 ¿m width and 520 ¿m length, design. With this vertical interconnect, multiple IC layers may be connected to achieve new levels of high density, low loss integration.",

author = "Henick, {Katherine J.} and Yook, {Jong Gwan} and Robertson, {Stephen V.} and Rebeiz, {Gabriel M.} and Katehi, {Linda P.B.}",

year = "1999",

doi = "10.1109/EUMA.1999.338477",

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note = "1999 29th European Microwave Conference, EuMC 1999 ; Conference date: 05-10-1999 Through 07-10-1999",

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AU - Henick, Katherine J.

AU - Yook, Jong Gwan

AU - Robertson, Stephen V.

AU - Rebeiz, Gabriel M.

AU - Katehi, Linda P.B.

PY - 1999

Y1 - 1999

N2 - A novel vertical interconnection utilizing finite ground coplanar waveguide (FGCPW) and silicon micromachining has been developed for W-band The measured results indicate insertion loss of only 0.6 dB. This transition uses standard processing techniques and is a compact, 520 ¿m width and 520 ¿m length, design. With this vertical interconnect, multiple IC layers may be connected to achieve new levels of high density, low loss integration.

AB - A novel vertical interconnection utilizing finite ground coplanar waveguide (FGCPW) and silicon micromachining has been developed for W-band The measured results indicate insertion loss of only 0.6 dB. This transition uses standard processing techniques and is a compact, 520 ¿m width and 520 ¿m length, design. With this vertical interconnect, multiple IC layers may be connected to achieve new levels of high density, low loss integration.

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T2 - 1999 29th European Microwave Conference, EuMC 1999

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ER -

W-band micromachined vertical interconnection for three-dimensional microwave ICs

Abstract

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All Science Journal Classification (ASJC) codes

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