Titanium salicide process suitable for submicron CMOS applications

C. Blair, E. Demirlioglu, E. Yoon, J. Pierce

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper reports a titanium salicide process capable of fabricating low resistance salicide (<5 ohms/sq.) on narrow polysilicon leads (line widths less than 0.35 μm) which are heavily doped with arsenic and boron. The process utilizes conventional processing but avoids excessive vertical scaling of the titanium silicide film. The process has been demonstrated on a 0.35 μm CMOS technology and results show that a process window exists which is suitable for technologies of 0.35 μm and below. The most serious scaling issue for titanium salicide appears to be the silicide film thickness.

Original languageEnglish
Title of host publicationSilicides, Germanides, and Their Interfaces
EditorsRobert W. Fathauer, Siegfried Mantl, Leo J. Schowalter, K.N. Tu
PublisherPubl by Materials Research Society
Number of pages6
ISBN (Print)1558992197
Publication statusPublished - 1994
EventProceedings of the 1993 Fall Meeting of the Materials Research Society - Boston, MA, USA
Duration: 1993 Nov 291993 Dec 2

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


OtherProceedings of the 1993 Fall Meeting of the Materials Research Society
CityBoston, MA, USA

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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