Thin film receiver materials for deterministic assembly by transfer printing

Tae Il Kim; Mo Joon Kim; Yei Hwan Jung; Hyejin Jang; Canan Dagdeviren; Hsuan An Pao; Sang June Cho; Andrew Carlson; Ki Jun Yu; Abid Ameen; Hyun Joong Chung; Sung Hun Jin; Zhenqiang Ma; John A. Rogers

doi:10.1021/cm501002b

Thin film receiver materials for deterministic assembly by transfer printing

Tae Il Kim, Mo Joon Kim, Yei Hwan Jung, Hyejin Jang, Canan Dagdeviren, Hsuan An Pao, Sang June Cho, Andrew Carlson, Ki Jun Yu, Abid Ameen, Hyun Joong Chung, Sung Hun Jin, Zhenqiang Ma, John A. Rogers

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

33 Citations (Scopus)

Abstract

We present a specially designed materials chemistry that provides ultrathin adhesive layers with persistent tacky surfaces in solid, nonflowable forms for use in transfer printing and related approaches to materials and micro/nanostructure assembly. The material can be photocured after assembly, to yield a robust and highly transparent coating that is also thermally and electrically stable, for applications in electronics, optoelectronics, and other areas of interest.

Original language	English
Pages (from-to)	3502-3507
Number of pages	6
Journal	Chemistry of Materials
Volume	26
Issue number	11
DOIs	https://doi.org/10.1021/cm501002b
Publication status	Published - 2014 Jun 10

All Science Journal Classification (ASJC) codes

Chemistry(all)
Chemical Engineering(all)
Materials Chemistry

Access to Document

10.1021/cm501002b

Cite this

@article{c789ac016905400a8ae2ea1ee5e9e54d,

title = "Thin film receiver materials for deterministic assembly by transfer printing",

abstract = "We present a specially designed materials chemistry that provides ultrathin adhesive layers with persistent tacky surfaces in solid, nonflowable forms for use in transfer printing and related approaches to materials and micro/nanostructure assembly. The material can be photocured after assembly, to yield a robust and highly transparent coating that is also thermally and electrically stable, for applications in electronics, optoelectronics, and other areas of interest.",

author = "Kim, {Tae Il} and Kim, {Mo Joon} and Jung, {Yei Hwan} and Hyejin Jang and Canan Dagdeviren and Pao, {Hsuan An} and Cho, {Sang June} and Andrew Carlson and Yu, {Ki Jun} and Abid Ameen and Chung, {Hyun Joong} and Jin, {Sung Hun} and Zhenqiang Ma and Rogers, {John A.}",

year = "2014",

month = jun,

day = "10",

doi = "10.1021/cm501002b",

language = "English",

volume = "26",

pages = "3502--3507",

journal = "Chemistry of Materials",

issn = "0897-4756",

publisher = "American Chemical Society",

number = "11",

}

TY - JOUR

T1 - Thin film receiver materials for deterministic assembly by transfer printing

AU - Kim, Tae Il

AU - Kim, Mo Joon

AU - Jung, Yei Hwan

AU - Jang, Hyejin

AU - Dagdeviren, Canan

AU - Pao, Hsuan An

AU - Cho, Sang June

AU - Carlson, Andrew

AU - Yu, Ki Jun

AU - Ameen, Abid

AU - Chung, Hyun Joong

AU - Jin, Sung Hun

AU - Ma, Zhenqiang

AU - Rogers, John A.

PY - 2014/6/10

Y1 - 2014/6/10

N2 - We present a specially designed materials chemistry that provides ultrathin adhesive layers with persistent tacky surfaces in solid, nonflowable forms for use in transfer printing and related approaches to materials and micro/nanostructure assembly. The material can be photocured after assembly, to yield a robust and highly transparent coating that is also thermally and electrically stable, for applications in electronics, optoelectronics, and other areas of interest.

AB - We present a specially designed materials chemistry that provides ultrathin adhesive layers with persistent tacky surfaces in solid, nonflowable forms for use in transfer printing and related approaches to materials and micro/nanostructure assembly. The material can be photocured after assembly, to yield a robust and highly transparent coating that is also thermally and electrically stable, for applications in electronics, optoelectronics, and other areas of interest.

UR - http://www.scopus.com/inward/record.url?scp=84902125012&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84902125012&partnerID=8YFLogxK

U2 - 10.1021/cm501002b

DO - 10.1021/cm501002b

M3 - Article

AN - SCOPUS:84902125012

SN - 0897-4756

VL - 26

SP - 3502

EP - 3507

JO - Chemistry of Materials

JF - Chemistry of Materials

IS - 11

ER -

Thin film receiver materials for deterministic assembly by transfer printing

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this