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Thermal stability of Cu films on TiN/Ti/Si(100) by partially ionized beam deposition
H. G. Jang, K. H. Kim, D. J. Choi, S. Han, S. C. Choi, W. K. Choi, H. J. Jung, S. K. Koh
Research output: Contribution to journal › Conference article › peer-review
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(Scopus)