Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

Song Wan Cho, Kyul Han, Yeonjin Yi, Seong Jun Kang, Kyung Hwa Yoo, Kwangho Jeong, Chung Nam Whang

Research output: Contribution to journalArticlepeer-review

29 Citations (Scopus)


A package-level reliability test using a solder ball of a Sn-Ag-Cu-Ge alloy, was investigated. After using a lead-free solder in the manufacturing process, the discoloring problem arises after many times in the reflow process. The surface oxidation of the lead-free solders were investigated using X-ray photoelectron spectroscopy (XPS). The results show that Sn-Ag-Cu-Ge alloy is a good candidate to solve the oxidation problem and it is important to know the thermal oxidation mechanism and characteristics of the Pb-free solders.

Original languageEnglish
Pages (from-to)111-114
Number of pages4
JournalAdvanced Engineering Materials
Issue number1-2
Publication statusPublished - 2006 Feb

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics


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