Thermal impedance to normal and superconducting metals

K. H. Yoo, A. C. Anderson

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)


A simple model is presented of the thermal impedance encountered in the transfer of heat between a dielectric solid and a superconducting metal containing defects, defects which could be introduced by deformation. The model is consistent with new as well as published data, and in particular explains an anomalously large thermal impedance in superconducting aluminum near 0.1 K.

Original languageEnglish
Pages (from-to)269-286
Number of pages18
JournalJournal of Low Temperature Physics
Issue number3-4
Publication statusPublished - 1986 May

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics


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