Abstract
A simple model is presented of the thermal impedance encountered in the transfer of heat between a dielectric solid and a superconducting metal containing defects, defects which could be introduced by deformation. The model is consistent with new as well as published data, and in particular explains an anomalously large thermal impedance in superconducting aluminum near 0.1 K.
| Original language | English |
|---|---|
| Pages (from-to) | 269-286 |
| Number of pages | 18 |
| Journal | Journal of Low Temperature Physics |
| Volume | 63 |
| Issue number | 3-4 |
| DOIs | |
| Publication status | Published - 1986 May |
All Science Journal Classification (ASJC) codes
- Atomic and Molecular Physics, and Optics
- Materials Science(all)
- Condensed Matter Physics