TY - GEN
T1 - Thermal effects of moisture inducing delamination in light-emitting diode packages
AU - Jianzheng, Hu
AU - Lianqiao, Yang
AU - Moo, Whan Shin
PY - 2006
Y1 - 2006
N2 - This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.
AB - This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.
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U2 - 10.1109/ECTC.2006.1645928
DO - 10.1109/ECTC.2006.1645928
M3 - Conference contribution
AN - SCOPUS:33845580674
SN - 1424401526
SN - 9781424401529
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1957
EP - 1962
BT - Proceedings - IEEE 56th Electronic Components and Technology Conference
T2 - IEEE 56th Electronic Components and Technology Conference
Y2 - 30 May 2006 through 2 June 2006
ER -