Thermal design of hot plate for 300-mm wafer heating in post-exposure bake

Jinho Lee, Hyun Goo Kwon, Sangwoo Shin, Sangjo Han, Jungik Ha, Hosun Yoo, Hyung Hee Cho

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


Temperature uniformity of a wafer during post-exposure bake (PEB) in lithography is an important factor in controlling critical dimension (CD) uniformity. In this study, a new hot plate system for the PEB of a 300-mm wafer was analyzed and designed. First, temperature deviation on the wafer caused by warpage was investigated, and the heater pattern of the multi-zone hot plate in the bake system was numerically analyzed. Then, a new heater pattern to enhance the temperature uniformity was proposed and tested experimentally. As a result, temperature uniformity within 0.087 °C on a 300-mm wafer was achieved.

Original languageEnglish
Pages (from-to)3195-3198
Number of pages4
JournalMicroelectronic Engineering
Issue number11
Publication statusPublished - 2011 Nov

Bibliographical note

Funding Information:
This research was supported by Samsung Electronics.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering


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