Thermal design of hot plate for 300-mm wafer heating in post-exposure bake

Jinho Lee; Hyun Goo Kwon; Sangwoo Shin; Sangjo Han; Jungik Ha; Hosun Yoo; Hyung Hee Cho

doi:10.1016/j.mee.2011.08.012

Thermal design of hot plate for 300-mm wafer heating in post-exposure bake

Jinho Lee, Hyun Goo Kwon, Sangwoo Shin, Sangjo Han, Jungik Ha, Hosun Yoo, Hyung Hee Cho

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

Temperature uniformity of a wafer during post-exposure bake (PEB) in lithography is an important factor in controlling critical dimension (CD) uniformity. In this study, a new hot plate system for the PEB of a 300-mm wafer was analyzed and designed. First, temperature deviation on the wafer caused by warpage was investigated, and the heater pattern of the multi-zone hot plate in the bake system was numerically analyzed. Then, a new heater pattern to enhance the temperature uniformity was proposed and tested experimentally. As a result, temperature uniformity within 0.087 °C on a 300-mm wafer was achieved.

Original language	English
Pages (from-to)	3195-3198
Number of pages	4
Journal	Microelectronic Engineering
Volume	88
Issue number	11
DOIs	https://doi.org/10.1016/j.mee.2011.08.012
Publication status	Published - 2011 Nov

Bibliographical note

Funding Information:
This research was supported by Samsung Electronics.

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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10.1016/j.mee.2011.08.012

Cite this

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title = "Thermal design of hot plate for 300-mm wafer heating in post-exposure bake",

abstract = "Temperature uniformity of a wafer during post-exposure bake (PEB) in lithography is an important factor in controlling critical dimension (CD) uniformity. In this study, a new hot plate system for the PEB of a 300-mm wafer was analyzed and designed. First, temperature deviation on the wafer caused by warpage was investigated, and the heater pattern of the multi-zone hot plate in the bake system was numerically analyzed. Then, a new heater pattern to enhance the temperature uniformity was proposed and tested experimentally. As a result, temperature uniformity within 0.087 °C on a 300-mm wafer was achieved.",

author = "Jinho Lee and Kwon, {Hyun Goo} and Sangwoo Shin and Sangjo Han and Jungik Ha and Hosun Yoo and Cho, {Hyung Hee}",

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AU - Lee, Jinho

AU - Kwon, Hyun Goo

AU - Shin, Sangwoo

AU - Han, Sangjo

AU - Ha, Jungik

AU - Yoo, Hosun

AU - Cho, Hyung Hee

N1 - Funding Information: This research was supported by Samsung Electronics.

PY - 2011/11

Y1 - 2011/11

N2 - Temperature uniformity of a wafer during post-exposure bake (PEB) in lithography is an important factor in controlling critical dimension (CD) uniformity. In this study, a new hot plate system for the PEB of a 300-mm wafer was analyzed and designed. First, temperature deviation on the wafer caused by warpage was investigated, and the heater pattern of the multi-zone hot plate in the bake system was numerically analyzed. Then, a new heater pattern to enhance the temperature uniformity was proposed and tested experimentally. As a result, temperature uniformity within 0.087 °C on a 300-mm wafer was achieved.

AB - Temperature uniformity of a wafer during post-exposure bake (PEB) in lithography is an important factor in controlling critical dimension (CD) uniformity. In this study, a new hot plate system for the PEB of a 300-mm wafer was analyzed and designed. First, temperature deviation on the wafer caused by warpage was investigated, and the heater pattern of the multi-zone hot plate in the bake system was numerically analyzed. Then, a new heater pattern to enhance the temperature uniformity was proposed and tested experimentally. As a result, temperature uniformity within 0.087 °C on a 300-mm wafer was achieved.

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Thermal design of hot plate for 300-mm wafer heating in post-exposure bake

Abstract

Bibliographical note

All Science Journal Classification (ASJC) codes

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