Abstract
In this paper, we report the thermal performance of a light-emitting diode (LED) headlamp module with a novel cooling system. An air-circulating cooling system was design for the LED headlamp module. The precise fluid field modeling and heat transfer analysis using computational fluid dynamics were performed according to the practical working conditions for the headlamp. The junction temperatures of LEDs were found to decrease by using the air-cooling system and, thus, improved the heat dissipating capability of the LED array. The junction temperature of the LED array was decreased from 70.6°C to 30.25°C when the circulating speed of the air increased from 0 to 120 km/h. Also, the temperature decrease of 2°C- 4°C was obtained by using fins. By thermal analysis, the cooling system of LED arrays for the headlamps was found to be feasible. Also, the reliability of the headlamp with LED arrays can be improved with a good cooling system.
Original language | English |
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Article number | 4655584 |
Pages (from-to) | 561-564 |
Number of pages | 4 |
Journal | IEEE Transactions on Device and Materials Reliability |
Volume | 8 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2008 Sept |
Bibliographical note
Funding Information:Manuscript received October 15, 2007; revised January 22, 2008. Current version published October 16, 2008. This work was supported in part by the Korea Institute of Industry Technology Evaluation and Planning and in part by the Korea Energy Management Corporation under Grant 2007-03-0018-0-000. The authors are with the Department of Material Science and Engineering, Myongji University, Yongin 449-728, Korea (e-mail: mwshin@mju.ac.kr). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TDMR.2008.2002355 Fig. 1. Schematic diagram of the air-cooling system. (a) Isotropic view. (b) Top view.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Safety, Risk, Reliability and Quality
- Electrical and Electronic Engineering