Thermal analysis of high power LED packages under the alternating current operation

Moo Whan Shin, Sun Ho Jang

Research output: Contribution to journalArticlepeer-review

46 Citations (Scopus)


In this paper we describe a novel thermal characterization method of GaN-based Light Emitting Diode (LED) package driven under the Alternating Current (AC) mode. The result was compared with the results from the thermal analysis for LED package operated under the Direct Current (DC) condition. Different from the DC condition, the junction temperature rise with the operation time of LED package was exhibited in a band formation. Finite Volume Method (FVM) was utilized to calculate the thermal performance of LED package under the AC condition using the input power extracted from the output current and voltage from the AC power supply. The experimental result was in a good agreement with the simulation data.

Original languageEnglish
Pages (from-to)48-50
Number of pages3
JournalSolid-State Electronics
Publication statusPublished - 2012 Feb

Bibliographical note

Funding Information:
The financial support from the Korea Photonics Technology Institute (LED standardization Project # B0010209) is appreciated. The research of Moo Whan Shin was supported by the MKE of Korea, under the ‘‘IT Consilience Creative Program” support program supervised by the NIPA (NIPA-2010-C1515-1001-0001).

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


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