Thermal analysis of high power GaN-based LEDs with ceramic package

Lianqiao Yang, Sunho Jang, Woongjoon Hwang, Moowhan Shin

Research output: Contribution to journalArticlepeer-review

85 Citations (Scopus)


In this paper we present thermal analysis of three kinds of ceramic package designs for high power LEDs. The analysis was made by transient thermal measurement and thermal simulation using the Finite Volume Method. The three ceramic packages under investigation employ same configuration of GaN-based chip, but they have different size and distribution of thermal vias. Three designs of LED packages resulted in significantly different thermal behaviors. Thermal behaviors, described as thermal resistance, of the three packaging designs were compared and evaluated as functions of bulk thermal resistance, spreading resistance, and surface roughness. The deviation between the simulated results and measured data were attributed to the different surface roughness in the interfaces between the packaging components. It was demonstrated that the junction temperature decreases with the effective contact area ratio in the LED packages.

Original languageEnglish
Pages (from-to)95-99
Number of pages5
JournalThermochimica Acta
Issue number1-2
Publication statusPublished - 2007 Apr 1

Bibliographical note

Funding Information:
This work was financially supported by the Korean Institute of Industrial Technology Evaluation and Planning.

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Condensed Matter Physics
  • Physical and Theoretical Chemistry


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