TY - GEN
T1 - Thermal analysis and modeling of led arrays for automotive headlamp
AU - Jang, Sun Ho
AU - Shin, Moo Whan
PY - 2008
Y1 - 2008
N2 - In this paper we report the thermal performance of LED head lamp module and the cooling system. The precise fluid field modeling and heat transfer analysis using a CFD (Computational Fluid Dynamics) were performed according to the practical working conditions for the headlamp. The junction temperatures of LEDs were found to decrease by using the air cooling system and thus improved the heat dissipating capability of the LED array. The junction temperature of the LED array was decreased from 70.6 °C to 30.25 °C when the circulating speed of the air increased from 0 km/h to 120 km/h. And the temperature decrease of 2-4 °C was obtained by using fins. By the thermal analysis, a new thermal design was obtained for the cooling system of LED arrays for the headlamps. Thus the reliability of the headlamp with LED arrays can be improved with a good cooling system.
AB - In this paper we report the thermal performance of LED head lamp module and the cooling system. The precise fluid field modeling and heat transfer analysis using a CFD (Computational Fluid Dynamics) were performed according to the practical working conditions for the headlamp. The junction temperatures of LEDs were found to decrease by using the air cooling system and thus improved the heat dissipating capability of the LED array. The junction temperature of the LED array was decreased from 70.6 °C to 30.25 °C when the circulating speed of the air increased from 0 km/h to 120 km/h. And the temperature decrease of 2-4 °C was obtained by using fins. By the thermal analysis, a new thermal design was obtained for the cooling system of LED arrays for the headlamps. Thus the reliability of the headlamp with LED arrays can be improved with a good cooling system.
UR - http://www.scopus.com/inward/record.url?scp=44149098284&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=44149098284&partnerID=8YFLogxK
U2 - 10.1115/IMECE2007-41756
DO - 10.1115/IMECE2007-41756
M3 - Conference contribution
AN - SCOPUS:44149098284
SN - 0791842991
SN - 9780791842997
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings
SP - 247
EP - 250
BT - Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007
T2 - ASME International Mechanical Engineering Congress and Exposition, IMECE 2007
Y2 - 11 November 2007 through 15 November 2007
ER -