The effects of wet compression by the Electronic Expansion Valve opening on the performance of a heat pump system

Kyoungjin Seong, Daehui Lee, Jinho Lee

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

In this study, by controlling the Electronic Expansion Valve opening, the influence of wet compression on a heat pump system was experimentally investigated in different heating conditions. The results demonstrate that the discharge temperature decreased and the mass flow rate increased, due to quality of the rising liquid droplets. It was also found that the heating capacity and power input of wet compression increased more than that of dry compression, with a superheat of 10 °C. The maximum COP (Coefficient of Performance) exists at a specific quality of ca. 0.94 to 0.90, as the power input in the region of wet compression is proportionally larger than the increase in the heating capacity, according to the decreasing quality. When the Entering Water Temperature of the Outdoor Heat Exchanger was 10 °C, 5 °C, and 0 °C, the COP increased by a maximum of ca. 12.4%, 10.6%, and 10.2%, respectively, in comparison to the superheat of 10 °C. In addition, the superheat at the discharge line is proposed as a proper controlling parameter to adjust the quality at the suction line, by varying the opening of the expansion valve during wet compression.

Original languageEnglish
Article number248
JournalApplied Sciences (Switzerland)
Volume7
Issue number3
DOIs
Publication statusPublished - 2017

Bibliographical note

Publisher Copyright:
© 2017 by the authors.

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Instrumentation
  • Engineering(all)
  • Process Chemistry and Technology
  • Computer Science Applications
  • Fluid Flow and Transfer Processes

Fingerprint

Dive into the research topics of 'The effects of wet compression by the Electronic Expansion Valve opening on the performance of a heat pump system'. Together they form a unique fingerprint.

Cite this