The effect of electrode heat sink in organic-electronic devices

Sang Hun Choi; Tae Il Lee; Hong Koo Baik; Hee Hwan Roh; Ohmyoung Kwon; Dong Hak Suh

doi:10.1063/1.3021071

The effect of electrode heat sink in organic-electronic devices

Sang Hun Choi, Tae Il Lee, Hong Koo Baik, Hee Hwan Roh, Ohmyoung Kwon, Dong Hak Suh

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

32 Citations (Scopus)

Abstract

Most of organic devices showed poor thermal stability and short lifetime due to Joule heating by current injection during operation. To increase the lifetime of the devices, thermal management must be considered. We demonstrated the polymer light-emitting diodes with thermally conductive substrate and Al/Cu double cathode to enhance the thermal stability of the device. Also, we proposed the correlation between lifetime (Δt) and device heat sink (ΔT). The heat sink of all organic devices is required to enhance device durability.

Original language	English
Article number	183301
Journal	Applied Physics Letters
Volume	93
Issue number	18
DOIs	https://doi.org/10.1063/1.3021071
Publication status	Published - 2008

All Science Journal Classification (ASJC) codes

Physics and Astronomy (miscellaneous)

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10.1063/1.3021071

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AU - Baik, Hong Koo

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AU - Kwon, Ohmyoung

AU - Suh, Dong Hak

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The effect of electrode heat sink in organic-electronic devices

Abstract

All Science Journal Classification (ASJC) codes

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