TensorCV: Accelerating Inference-Adjacent Computation Using Tensor Processors

Dongho Ha, Won Woo Ro, Hung Wei Tseng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The advancements in AI/ML accelerators have made the core AI/ML computation relatively insignificant in application pipelines. For example, inferencing only accounts for 3% of the latency in an image-based ML pipeline with the help of Tensor Cores. The mismatch in performance growth between ML model computation and ML-adjacent computation, the producer and consumer of ML models, will become the bottleneck leading to system inefficiency. This paper presents a set of innovative algorithms to allow the entire ML-based computer vision pipelines to leverage AI/ML accelerators. Our proposed algorithms feature matrix-based operations that AI/ML accelerators specialize in. Simply compiler optimizations cannot take full advantage of hardware acceleration without revisiting algorithms. This paper implements the proposed algorithms as an open-source library, TensorCV, in a system platform with Tensor Cores. TensorCV shows a 6.12 × speedup in optimized ML-adjacent functions and saves 81 % energy consumption on modern heterogeneous computers. The code is available at https://github.com/escalab/TensorCV.

Original languageEnglish
Title of host publication2023 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350311754
DOIs
Publication statusPublished - 2023
Event2023 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2023 - Vienna, Austria
Duration: 2023 Aug 72023 Aug 8

Publication series

NameProceedings of the International Symposium on Low Power Electronics and Design
Volume2023-August
ISSN (Print)1533-4678

Conference

Conference2023 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2023
Country/TerritoryAustria
CityVienna
Period23/8/723/8/8

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

All Science Journal Classification (ASJC) codes

  • General Engineering

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