Abstract
For an accurate system level electromagnetic (EM) modeling of digital IC packages and PC boards, a new methodology is developed combining electromagnetic and circuit simulators. The EM modeling of geometrical details in the IC's structures based on a full-wave finite element method provides accurate equivalent circuits which are incorporated in a system level circuit simulator. This circuit simulator results in HSPICE type of RLC circuits which are then analyzed in time domain to compute switching noise on any designate places.
| Original language | English |
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| Pages | 238-240 |
| Number of pages | 3 |
| Publication status | Published - 1996 |
| Event | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA Duration: 1996 Oct 28 → 1996 Oct 30 |
Other
| Other | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging |
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| City | Napa Valley, CA, USA |
| Period | 96/10/28 → 96/10/30 |
All Science Journal Classification (ASJC) codes
- General Engineering