Abstract
A flexible polysilicon strain gauge array has been realized using surface micromachining with SiO2 sacrificial layer. The realized sensor array is mechanically flexible, which can be attached on nonplanar surfaces. To realize the flexible strain gauge, a new packaging scheme using polysilicon/oxide based surface-micromachining was developed. The proposed packaging scheme completes the strain sensors and the circuit board on a single process, which eliminates additional assembly and alignment problems. The measured gauge factor shows that it is more sensitive than metal strain gauge. Unlike a single-crystal silicon strain gauge, the proposed polysilicon gauge does not have any limitations in the direction of strain.
| Original language | English |
|---|---|
| Pages | 582-585 |
| Number of pages | 4 |
| Publication status | Published - 2003 |
| Event | IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan Duration: 2003 Jan 19 → 2003 Jan 23 |
Other
| Other | IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems |
|---|---|
| Country/Territory | Japan |
| City | Kyoto |
| Period | 03/1/19 → 03/1/23 |
All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Mechanical Engineering
- Electrical and Electronic Engineering