Sub-100 nm regrown S/D Gate-Last In0.7Ga0.3As QW MOSFETs with μn,eff > 5,500 cm2/V-s

C. S. Shin; W. K. Park; Sh Shin; Yd Cho; Dh Ko; T. W. Kim; D. H. Koh; Hm Kwon; R. J.W. Hill; P. Kirsch; W. Maszara; D. H. Kim

doi:10.1109/VLSIT.2014.6894351

Sub-100 nm regrown S/D Gate-Last In_0.7Ga_0.3As QW MOSFETs with μ_n,eff > 5,500 cm²/V-s

C. S. Shin, W. K. Park, Sh Shin, Yd Cho, Dh Ko, T. W. Kim, D. H. Koh, Hm Kwon, R. J.W. Hill, P. Kirsch, W. Maszara, D. H. Kim

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

12 Citations (Scopus)

Abstract

This paper reports on gate-last (GL) In_0.7Ga_0.3As QW MOSFETs with regrown S/D by MOCVD. Long-channel devices exhibit excellent electrostatics and carrier transport (SS=80mV/dec., DIBL=22mV/V, and μ_n,eff>5,500 cm²/V-s at 300k). Short-channel device with L_g = 40 nm also exhibit excellent electrostatic integrity of SS = 105 mV/dec., and DIBL = 150 mV/V, together with g_m-max = 2 mS/μm at V_DS = 0.5 V. This record performance is achieved by using a low D_it and Al₂O₃/HfO₂ gate stack with EOT ∼ 1-nm, optimized selective S/D regrowth with MOCVD, and GL process.

Original language	English
Title of host publication	Digest of Technical Papers - Symposium on VLSI Technology
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781479933310
DOIs	https://doi.org/10.1109/VLSIT.2014.6894351
Publication status	Published - 2014 Sept 8
Event	34th Symposium on VLSI Technology, VLSIT 2014 - Honolulu, United States Duration: 2014 Jun 9 → 2014 Jun 12

Publication series

Name	Digest of Technical Papers - Symposium on VLSI Technology
ISSN (Print)	0743-1562

Other

Other	34th Symposium on VLSI Technology, VLSIT 2014
Country/Territory	United States
City	Honolulu
Period	14/6/9 → 14/6/12

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/VLSIT.2014.6894351

Cite this

Shin, C. S., Park, W. K., Shin, S., Cho, Y., Ko, D., Kim, T. W., Koh, D. H., Kwon, H., Hill, R. J. W., Kirsch, P., Maszara, W., & Kim, D. H. (2014). Sub-100 nm regrown S/D Gate-Last In_0.7Ga_0.3As QW MOSFETs with μ_n,eff > 5,500 cm²/V-s. In Digest of Technical Papers - Symposium on VLSI Technology Article 6894351 (Digest of Technical Papers - Symposium on VLSI Technology). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VLSIT.2014.6894351

@inproceedings{0433de7eae084d11a1f6fb4bbc51d344,

title = "Sub-100 nm regrown S/D Gate-Last In0.7Ga0.3As QW MOSFETs with μn,eff > 5,500 cm2/V-s",

abstract = "This paper reports on gate-last (GL) In0.7Ga0.3As QW MOSFETs with regrown S/D by MOCVD. Long-channel devices exhibit excellent electrostatics and carrier transport (SS=80mV/dec., DIBL=22mV/V, and μn,eff>5,500 cm2/V-s at 300k). Short-channel device with Lg = 40 nm also exhibit excellent electrostatic integrity of SS = 105 mV/dec., and DIBL = 150 mV/V, together with gm-max = 2 mS/μm at VDS = 0.5 V. This record performance is achieved by using a low Dit and Al2O3/HfO2 gate stack with EOT ∼ 1-nm, optimized selective S/D regrowth with MOCVD, and GL process.",

author = "Shin, {C. S.} and Park, {W. K.} and Sh Shin and Yd Cho and Dh Ko and Kim, {T. W.} and Koh, {D. H.} and Hm Kwon and Hill, {R. J.W.} and P. Kirsch and W. Maszara and Kim, {D. H.}",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 34th Symposium on VLSI Technology, VLSIT 2014 ; Conference date: 09-06-2014 Through 12-06-2014",

year = "2014",

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doi = "10.1109/VLSIT.2014.6894351",

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Shin, CS, Park, WK, Shin, S, Cho, Y, Ko, D, Kim, TW, Koh, DH, Kwon, H, Hill, RJW, Kirsch, P, Maszara, W & Kim, DH 2014, Sub-100 nm regrown S/D Gate-Last In_0.7Ga_0.3As QW MOSFETs with μ_n,eff > 5,500 cm²/V-s. in Digest of Technical Papers - Symposium on VLSI Technology., 6894351, Digest of Technical Papers - Symposium on VLSI Technology, Institute of Electrical and Electronics Engineers Inc., 34th Symposium on VLSI Technology, VLSIT 2014, Honolulu, United States, 14/6/9. https://doi.org/10.1109/VLSIT.2014.6894351

Sub-100 nm regrown S/D Gate-Last In_0.7Ga_0.3As QW MOSFETs with μ_n,eff > 5,500 cm²/V-s. / Shin, C. S.; Park, W. K.; Shin, Sh et al.
Digest of Technical Papers - Symposium on VLSI Technology. Institute of Electrical and Electronics Engineers Inc., 2014. 6894351 (Digest of Technical Papers - Symposium on VLSI Technology).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Shin, C. S.

AU - Park, W. K.

AU - Shin, Sh

AU - Cho, Yd

AU - Ko, Dh

AU - Kim, T. W.

AU - Koh, D. H.

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AU - Hill, R. J.W.

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AU - Maszara, W.

AU - Kim, D. H.

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N2 - This paper reports on gate-last (GL) In0.7Ga0.3As QW MOSFETs with regrown S/D by MOCVD. Long-channel devices exhibit excellent electrostatics and carrier transport (SS=80mV/dec., DIBL=22mV/V, and μn,eff>5,500 cm2/V-s at 300k). Short-channel device with Lg = 40 nm also exhibit excellent electrostatic integrity of SS = 105 mV/dec., and DIBL = 150 mV/V, together with gm-max = 2 mS/μm at VDS = 0.5 V. This record performance is achieved by using a low Dit and Al2O3/HfO2 gate stack with EOT ∼ 1-nm, optimized selective S/D regrowth with MOCVD, and GL process.

AB - This paper reports on gate-last (GL) In0.7Ga0.3As QW MOSFETs with regrown S/D by MOCVD. Long-channel devices exhibit excellent electrostatics and carrier transport (SS=80mV/dec., DIBL=22mV/V, and μn,eff>5,500 cm2/V-s at 300k). Short-channel device with Lg = 40 nm also exhibit excellent electrostatic integrity of SS = 105 mV/dec., and DIBL = 150 mV/V, together with gm-max = 2 mS/μm at VDS = 0.5 V. This record performance is achieved by using a low Dit and Al2O3/HfO2 gate stack with EOT ∼ 1-nm, optimized selective S/D regrowth with MOCVD, and GL process.

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