Silicon carbide whisker-reinforced ceramic tape for high-power components

Sae Han Na Doo, Won Bae Lim, Jun Seok Lee, Chan Su Han, Yong Soo Cho, Chang Geun Yoo

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


An attempt to enhance both mechanical strength and thermal conductivity of glass-based tapes is described. Flexural strength of ∼420 MPa and thermal conductivity of ∼10.3 W/m/K have been achieved in fully densified tape comprising calcium aluminoborosilicate glass, aluminum nitride, and silicon carbide whiskers. Silicon carbide whiskers aligned parallel to the casting direction contributed significantly to the reinforcement of the microstructure with accompanying extensive densification over a broad temperature range. These results are compared with the more typical alumina filler substituted for the aluminum nitride.

Original languageEnglish
Pages (from-to)240-245
Number of pages6
JournalInternational Journal of Applied Ceramic Technology
Issue number2
Publication statusPublished - 2014 Mar

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Condensed Matter Physics
  • Marketing
  • Materials Chemistry


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