An attempt to enhance both mechanical strength and thermal conductivity of glass-based tapes is described. Flexural strength of ∼420 MPa and thermal conductivity of ∼10.3 W/m/K have been achieved in fully densified tape comprising calcium aluminoborosilicate glass, aluminum nitride, and silicon carbide whiskers. Silicon carbide whiskers aligned parallel to the casting direction contributed significantly to the reinforcement of the microstructure with accompanying extensive densification over a broad temperature range. These results are compared with the more typical alumina filler substituted for the aluminum nitride.
|Number of pages||6|
|Journal||International Journal of Applied Ceramic Technology|
|Publication status||Published - 2014 Mar|
All Science Journal Classification (ASJC) codes
- Ceramics and Composites
- Condensed Matter Physics
- Materials Chemistry