TY - GEN
T1 - Signal integrity enhancement of high-speed digital interconnect with discontinuous and asymmetric structures for mobile applications
AU - Koo, Tae Wan
AU - Kang, Hee Do
AU - Ha, Jeunguk
AU - Koh, Eunkwang
AU - Yook, Jong Gwan
PY - 2013
Y1 - 2013
N2 - In this paper, signal integrity (SI) of a mobile high-definition link (MHL) system is analyzed, having the discontinuous and asymmetric structures. In the SI analysis of the MHL system, three dimensional (3D) electromagnetic (EM) solver and time domain reflectometry (TDR) method are carried out. As a result, the differential signals with the discontinuous reference plane experience the degeneration of transmission characteristic due to the impedance mismatch, rendering by discontinuities in return current path of the signals. Moreover, it is found that the SI characteristic of the differential signal could be significantly degenerated, when the asymmetric guard traces with ground vias for electromagnetic interference (EMI) reduction are located closer to the signal trace than the balanced reference plane. Therefore, SI can be guaranteed with widely open eye diagram using the symmetric and continuous reference plane for the coupled signal lines in the high-speed digital interconnect.
AB - In this paper, signal integrity (SI) of a mobile high-definition link (MHL) system is analyzed, having the discontinuous and asymmetric structures. In the SI analysis of the MHL system, three dimensional (3D) electromagnetic (EM) solver and time domain reflectometry (TDR) method are carried out. As a result, the differential signals with the discontinuous reference plane experience the degeneration of transmission characteristic due to the impedance mismatch, rendering by discontinuities in return current path of the signals. Moreover, it is found that the SI characteristic of the differential signal could be significantly degenerated, when the asymmetric guard traces with ground vias for electromagnetic interference (EMI) reduction are located closer to the signal trace than the balanced reference plane. Therefore, SI can be guaranteed with widely open eye diagram using the symmetric and continuous reference plane for the coupled signal lines in the high-speed digital interconnect.
UR - http://www.scopus.com/inward/record.url?scp=84893189292&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893189292&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2013.6670503
DO - 10.1109/ISEMC.2013.6670503
M3 - Conference contribution
AN - SCOPUS:84893189292
SN - 9781479904082
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 713
EP - 717
BT - Proceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
T2 - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
Y2 - 5 August 2013 through 9 August 2013
ER -