Self-Convectional three-dimensional integrated circuit cooling system using micro flat heat pipe for portable devices

Namjae Kim, Shiho Kim

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)


A self-convectional three-dimensional integrated circuit (3D IC) cooling system using micro flat heat pipes (MFHP) was proposed and the electrothermal behavior of the proposed structure was modeled by an equivalent circuit for simulation. Experimental measurements using the fabricated evaluation board for the 3D IC cooling system demonstrated that the temperature of the chip under test drops about 42°C due to the MFHP on the chip in steady state. The cooling performance of the proposed system is satisfactory for use as a 3D IC cooling system for mobile applications. We have applied the proposed system to the central processing unit cooler of a commercial laptop personal computer (PC). The volume of an air cooling system with conventional heat pipes for a laptop PC is about 40 times larger than that of the proposed system. However, the cooling performance of the proposed system is comparable to the original air cooler in the laptop PC both for horizontal and for vertical operation of the MFHP. The main advantage of the proposed cooler is that it is a slim, noiseless system that operates without additional cooling power consumption. The experimental results for vertical and horizontal operation of the MFHP demonstrate the possibility of the proposed self-convection MFHP architecture as a solution for the cooling system of 3D ICs that is suitable for portable devices.

Original languageEnglish
Pages (from-to)924-932
Number of pages9
JournalHeat Transfer Engineering
Issue number10
Publication statusPublished - 2014 Jul 3

Bibliographical note

Funding Information:
This work was supported by the IT R&D program of KEIT (Korea Evaluation Institute of Industrial Technology; KI002134, Wafer Level 3D IC Design and Integration) and was completed as part of the “IT Consilience Creative Program” supervised by NIPA (National IT Industry Promotion Agency; NIPA-2013-H0203-13-1002). The authors thank Youngkyo Gim for assistance during experiments. In addition, the authors also thank Dr. Seok-Hwan Moon, ETRI, Korea, for technical discussions and for providing MFHP samples. The SPICE circuit simulator used in this research was supported by IDEC.

Publisher Copyright:
© 2014 Copyright Taylor & Francis Group, LLC.

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes


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