Self-assembled monolayer as an antiadhesion layer on a nickel nanostamper in the nanoreplication process for optoelectronic applications

In this letter, self-assembled monolayer (SAM) was applied as an antiadhesion layer in the nanoreplication process to reduce the surface energy between the nanostamper and the polymeric nanopatterns. After electrochemical pretreatment process, n -dodecanethiol SAM was deposited on the nickel stamper using the solution deposition method. To examine the feasibility of the SAM as an antiadhesion layer, contact angle and lateral friction force were measured at room temperature. To verify the effectiveness of SAM for nanoreplication process, polymeric patterns were replicated by hot-embossing process using SAM-deposited nickel stamper. To apply our method to replication of sub- 100-nm -scale nanopillar arrays, the nanopatterned substrate with nanopillar arrays was replicated using nanoinjection molding process with SAM-deposited nickel stamper.