Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators

Y. Eun; H. Na; J. Choi; J. Kim

doi:10.1109/SENSOR.2009.5285921

Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators

Y. Eun, H. Na, J. Choi, J. Kim

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We have designed, fabricated and tested self-aligned angular vertical comb-drive (AVC) actuators by on-chip assembly technique using in-plane electrothermal actuators. The AVC actuators are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etching steps. The maximum optical scan angle of 30.7° is achieved at 4.56 kHz under the sinusoidal driving voltage of 0∼80 V applied to the AVC actuator. After the reliability test performed by operating the actuator for 1.6×10⁸ cycles, the measured optical scan angle variation and resonant frequency change were within 8 Hz and 1.1%, respectively.

Original language	English
Title of host publication	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages	908-911
Number of pages	4
DOIs	https://doi.org/10.1109/SENSOR.2009.5285921
Publication status	Published - 2009
Event	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States Duration: 2009 Jun 21 → 2009 Jun 25

Publication series

Name	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Country/Territory	United States
City	Denver, CO
Period	09/6/21 → 09/6/25

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/SENSOR.2009.5285921

Cite this

Eun, Y., Na, H., Choi, J., & Kim, J. (2009). Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 908-911). Article 5285921 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285921

Eun, Y. ; Na, H. ; Choi, J. et al. / Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators. TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. pp. 908-911 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

@inproceedings{634b856837bf4bffa961da4071690372,

title = "Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators",

abstract = "We have designed, fabricated and tested self-aligned angular vertical comb-drive (AVC) actuators by on-chip assembly technique using in-plane electrothermal actuators. The AVC actuators are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etching steps. The maximum optical scan angle of 30.7° is achieved at 4.56 kHz under the sinusoidal driving voltage of 0∼80 V applied to the AVC actuator. After the reliability test performed by operating the actuator for 1.6×108 cycles, the measured optical scan angle variation and resonant frequency change were within 8 Hz and 1.1%, respectively.",

author = "Y. Eun and H. Na and J. Choi and J. Kim",

year = "2009",

doi = "10.1109/SENSOR.2009.5285921",

language = "English",

isbn = "9781424441938",

series = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems",

pages = "908--911",

booktitle = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems",

note = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems ; Conference date: 21-06-2009 Through 25-06-2009",

}

Eun, Y, Na, H, Choi, J & Kim, J 2009, Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators. in TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems., 5285921, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 908-911, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, United States, 09/6/21. https://doi.org/10.1109/SENSOR.2009.5285921

Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators. / Eun, Y.; Na, H.; Choi, J. et al.
TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 908-911 5285921 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators

AU - Eun, Y.

AU - Na, H.

AU - Choi, J.

AU - Kim, J.

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N2 - We have designed, fabricated and tested self-aligned angular vertical comb-drive (AVC) actuators by on-chip assembly technique using in-plane electrothermal actuators. The AVC actuators are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etching steps. The maximum optical scan angle of 30.7° is achieved at 4.56 kHz under the sinusoidal driving voltage of 0∼80 V applied to the AVC actuator. After the reliability test performed by operating the actuator for 1.6×108 cycles, the measured optical scan angle variation and resonant frequency change were within 8 Hz and 1.1%, respectively.

AB - We have designed, fabricated and tested self-aligned angular vertical comb-drive (AVC) actuators by on-chip assembly technique using in-plane electrothermal actuators. The AVC actuators are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etching steps. The maximum optical scan angle of 30.7° is achieved at 4.56 kHz under the sinusoidal driving voltage of 0∼80 V applied to the AVC actuator. After the reliability test performed by operating the actuator for 1.6×108 cycles, the measured optical scan angle variation and resonant frequency change were within 8 Hz and 1.1%, respectively.

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T3 - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

SP - 908

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BT - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

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Eun Y, Na H, Choi J, Kim J. Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 908-911. 5285921. (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). doi: 10.1109/SENSOR.2009.5285921

Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators

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