Segmented wave analysis of surface plasmon resonance on curved surface

Hyunwoong Lee, Donghyun Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Surface plasmon resonance (SPR) has been heavily used as biosensors and studied dominantly on a flat surface. Recently, flexible sensor platforms have emerged, for example, as wearable devices. Here, we report investigation of SPR characteristics on a curved film structure. A rigorous 3D computational model requires extremely heavy calculation time and resources. Therefore, we adopted segmentation analysis in which curved surface is divided into an array of flat segments. Such analysis allows fast and efficient calculation. The results indicate that increased curvature produces broader SPR due to wider momentum-matching. The segmentation analysis is expected to play a critical role for diverse optical elements on curved surface.

Original languageEnglish
Title of host publicationInternational Conference on Nano-Bio Sensing, Imaging, and Spectroscopy 2017
EditorsJaebum Choo, Seung-Han Park
PublisherSPIE
ISBN (Electronic)9781510610934
DOIs
Publication statusPublished - 2017
EventInternational Conference on Nano-Bio Sensing, Imaging, and Spectroscopy 2017 - Jeju, Korea, Republic of
Duration: 2017 Feb 222017 Feb 24

Publication series

NameProgress in Biomedical Optics and Imaging - Proceedings of SPIE
Volume10324
ISSN (Print)1605-7422

Other

OtherInternational Conference on Nano-Bio Sensing, Imaging, and Spectroscopy 2017
Country/TerritoryKorea, Republic of
CityJeju
Period17/2/2217/2/24

Bibliographical note

Funding Information:
This work was supported by the National Research Foundation (NRF) grants funded by the Korean Government (20110017500, NRF-2012R1A4A1029061, and 2015R1A2A1A10052826).

Publisher Copyright:
© 2017 SPIE.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Biomaterials
  • Radiology Nuclear Medicine and imaging

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