Reliability of high-power LED packaging and assembly

Cheng Yi Liu; S. W. Ricky Lee; Moo Whan Shin; Yi Shao Lai

doi:10.1016/j.microrel.2012.02.023

Reliability of high-power LED packaging and assembly

Cheng Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi Shao Lai

School of Integrated Technology

Research output: Contribution to journal › Editorial › peer-review

1 Citation (Scopus)

Original language	English
Pages (from-to)	761
Number of pages	1
Journal	Microelectronics Reliability
Volume	52
Issue number	5
DOIs	https://doi.org/10.1016/j.microrel.2012.02.023
Publication status	Published - 2012 May

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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10.1016/j.microrel.2012.02.023

Cite this

@article{f9f2a33c15f8405ebeb119f64afce398,

title = "Reliability of high-power LED packaging and assembly",

author = "Liu, {Cheng Yi} and {Ricky Lee}, {S. W.} and Shin, {Moo Whan} and Lai, {Yi Shao}",

year = "2012",

month = may,

doi = "10.1016/j.microrel.2012.02.023",

language = "English",

volume = "52",

pages = "761",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Limited",

number = "5",

}

TY - JOUR

T1 - Reliability of high-power LED packaging and assembly

AU - Liu, Cheng Yi

AU - Ricky Lee, S. W.

AU - Shin, Moo Whan

AU - Lai, Yi Shao

PY - 2012/5

Y1 - 2012/5

UR - http://www.scopus.com/inward/record.url?scp=84860388018&partnerID=8YFLogxK

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U2 - 10.1016/j.microrel.2012.02.023

DO - 10.1016/j.microrel.2012.02.023

M3 - Editorial

AN - SCOPUS:84860388018

SN - 0026-2714

VL - 52

SP - 761

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 5

ER -

Reliability of high-power LED packaging and assembly

All Science Journal Classification (ASJC) codes

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