RayChip®: Real-time ray-tracing chip for embedded applications

Woo Chan Park; Hee Jin Shin; Byoungok Lee; Hyungmin Yoon; Tack Don Han

doi:10.1109/HOTCHIPS.2014.7478825

RayChip^®: Real-time ray-tracing chip for embedded applications

Woo Chan Park, Hee Jin Shin, Byoungok Lee, Hyungmin Yoon, Tack Don Han

College of Computing

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

This article consists of a collection of slides from the author's conference presentation on the special features, system design and architectures, processing capabilities, and targeted markets for SiliconArts' RayChip, the world's first commercialized chip targeted to realize real-time ray tracing for embedded applications such as TV, media box and game console.

Original language	English
Title of host publication	2014 IEEE Hot Chips 26 Symposium, HCS 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781467388832
DOIs	https://doi.org/10.1109/HOTCHIPS.2014.7478825
Publication status	Published - 2014 May 25
Event	26th IEEE Hot Chips Symposium, HCS 2014 - Cupertino, United States Duration: 2014 Aug 10 → 2014 Aug 12

Publication series

Name	2014 IEEE Hot Chips 26 Symposium, HCS 2014

Other

Other	26th IEEE Hot Chips Symposium, HCS 2014
Country/Territory	United States
City	Cupertino
Period	14/8/10 → 14/8/12

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Computer Networks and Communications

Access to Document

10.1109/HOTCHIPS.2014.7478825

Cite this

@inproceedings{c2eb24030125434e899a3c73a5f0603a,

title = "RayChip{\textregistered}: Real-time ray-tracing chip for embedded applications",

abstract = "This article consists of a collection of slides from the author's conference presentation on the special features, system design and architectures, processing capabilities, and targeted markets for SiliconArts' RayChip, the world's first commercialized chip targeted to realize real-time ray tracing for embedded applications such as TV, media box and game console.",

author = "Park, {Woo Chan} and Shin, {Hee Jin} and Byoungok Lee and Hyungmin Yoon and Han, {Tack Don}",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 26th IEEE Hot Chips Symposium, HCS 2014 ; Conference date: 10-08-2014 Through 12-08-2014",

year = "2014",

month = may,

day = "25",

doi = "10.1109/HOTCHIPS.2014.7478825",

language = "English",

series = "2014 IEEE Hot Chips 26 Symposium, HCS 2014",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2014 IEEE Hot Chips 26 Symposium, HCS 2014",

address = "United States",

}

Park, WC, Shin, HJ, Lee, B, Yoon, H & Han, TD 2014, RayChip^®: Real-time ray-tracing chip for embedded applications. in 2014 IEEE Hot Chips 26 Symposium, HCS 2014., 7478825, 2014 IEEE Hot Chips 26 Symposium, HCS 2014, Institute of Electrical and Electronics Engineers Inc., 26th IEEE Hot Chips Symposium, HCS 2014, Cupertino, United States, 14/8/10. https://doi.org/10.1109/HOTCHIPS.2014.7478825

TY - GEN

T1 - RayChip®

T2 - 26th IEEE Hot Chips Symposium, HCS 2014

AU - Park, Woo Chan

AU - Shin, Hee Jin

AU - Lee, Byoungok

AU - Yoon, Hyungmin

AU - Han, Tack Don

PY - 2014/5/25

Y1 - 2014/5/25

N2 - This article consists of a collection of slides from the author's conference presentation on the special features, system design and architectures, processing capabilities, and targeted markets for SiliconArts' RayChip, the world's first commercialized chip targeted to realize real-time ray tracing for embedded applications such as TV, media box and game console.

AB - This article consists of a collection of slides from the author's conference presentation on the special features, system design and architectures, processing capabilities, and targeted markets for SiliconArts' RayChip, the world's first commercialized chip targeted to realize real-time ray tracing for embedded applications such as TV, media box and game console.

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UR - http://www.scopus.com/inward/citedby.url?scp=84982839183&partnerID=8YFLogxK

U2 - 10.1109/HOTCHIPS.2014.7478825

DO - 10.1109/HOTCHIPS.2014.7478825

M3 - Conference contribution

AN - SCOPUS:84982839183

T3 - 2014 IEEE Hot Chips 26 Symposium, HCS 2014

BT - 2014 IEEE Hot Chips 26 Symposium, HCS 2014

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 10 August 2014 through 12 August 2014

ER -