Quench protection for HTS current leads by adding connected HTS bridges

Woo Seung Lee, Young Jin Hwang, Jinsub Kim, Seokho Nam, Young Gun Park, Tae Kuk Ko

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1 Citation (Scopus)

Abstract

Superconducting magnet systems operated at cryogenic temperature require high temperature superconducting (HTS) current leads to reduce the heat intrusion from the power supply at room temperature. However, some kinds of accidents, such as cryogenic failure, can cause a quench in the HTS current lead. Since the current conducting through the HTS current lead is very large, the quench in a HTS part can lead to a severe device failure. Therefore a study of a protection method for the HTS current lead is important. Generally, the HTS part of current lead used in large scale magnet systems has multiple separated HTS tape strands. They are electrically not connected or poorly connected. Therefore the quench in one strand affects other strands in current lead by applying additional loads for the other parts of the HTS current lead. In this paper, a strand-to-strand bridging method with HTS tapes is proposed as a quench protection method. Small scale HTS current leads with 2G HTS tapes and the suggested bridging method have been fabricated and tested.

Original languageEnglish
Article number6651697
JournalIEEE Transactions on Applied Superconductivity
Volume24
Issue number3
DOIs
Publication statusPublished - 2014 Jun

Bibliographical note

Funding Information:
Manuscript received July 15, 2013; accepted October 21, 2013. Date of publication November 1, 2013; date of current version November 18, 2013. This work was supported in part by the National R&D Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and Future Planning under Grant 2012M1A7A1A02034484, and by the Human Resources Development program (No. 20124030200040) of the Korea Institute of Energy Technology Evaluation and Planning (KETEP) grant funded by the Korea government Ministry of Trade, Industry, and Energy. (Corresponding author: T. K. Ko.) W. S. Lee, Y. J. Hwang, J. Kim, S. Nam, Y. G. Park, and T. K. Ko are with the Electronics and Electrical Engineering Department, Yonsei University, Seoul 120-749, Korea (e-mail: tkko@yonsei.ac.kr).

Funding Information:
This work was supported in part by the National R&D Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and Future Planning under Grant 2012M1A7A1A02034484, and by the Human Resources Development program (No. 20124030200040) of the Korea Institute of Energy Technology Evaluation and Planning (KETEP) grant funded by the Korea government Ministry of Trade, Industry, and Energy.

Publisher Copyright:
© 2013 IEEE.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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