Preparation of silicon-on-insulator wafer using spin etching and a subsequent selective etching process

Engineering

• Etching Process 100%
• Selective Etching 80%
• Thickness 60%
• Boron Concentration 40%
• Thinning Process 40%
• Surface Layer 20%
• Chemical Mechanical Polishing 20%
• Si Wafer 20%
• Polishing Process 20%
• Damaged Layer 20%
• Water 20%
• High Quality 20%
• Grinding (Machining) 20%

Material Science

• Silicon on Insulator 80%
• Solution 40%
• Etching 40%
• Surface Roughness 20%