Abstract
A new breakdown model for gate oxides under constant current stresses is proposed, which directly relates the oxide lifetime to the stress current density and includes the statistical nature of oxide breakdown using the effective oxide thickness. It is shown that this model can reliably predict the TDDB of oxides for any current stress levels and oxide areas.
Original language | English |
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Pages (from-to) | 1241-1242 |
Number of pages | 2 |
Journal | Electronics Letters |
Volume | 32 |
Issue number | 13 |
DOIs | |
Publication status | Published - 1996 Jun 20 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering