TY - GEN
T1 - Power noise suppression using dual spiral resonator with modified ground clearance for high-speed PCB
AU - Chung, Tong Ho
AU - Kang, Hee Do
AU - Song, Tae Lim
AU - Yook, Jong Gwan
PY - 2011
Y1 - 2011
N2 - In this paper, to the aim of 3.2 GHz noise suppression band with small area, investigation of several modified ground structure (MGS) dual spiral resonators are applied in the vicinity of the DDR3 high-speed circuit. Using two-turn dual spiral resonator, the area of the spiral on a power distribution network (PDN) is decreased to 45% compared with four-turn single spiral resonator and to achieve wider noise suppression frequency band, MGS dual spiral resonator, which make higher self resonance frequency (SRF) and inductance value, are applied. The proposed dual spiral resonator with MGS has 8 to 19 dB power noise suppression characteristic from second to fourth harmonic frequency band. By applying this concept, power noise suppression can be guaranteed with small area for various applications of the more high-speed digital circuits such as USB 3.0, SATA 3.0 or etc.
AB - In this paper, to the aim of 3.2 GHz noise suppression band with small area, investigation of several modified ground structure (MGS) dual spiral resonators are applied in the vicinity of the DDR3 high-speed circuit. Using two-turn dual spiral resonator, the area of the spiral on a power distribution network (PDN) is decreased to 45% compared with four-turn single spiral resonator and to achieve wider noise suppression frequency band, MGS dual spiral resonator, which make higher self resonance frequency (SRF) and inductance value, are applied. The proposed dual spiral resonator with MGS has 8 to 19 dB power noise suppression characteristic from second to fourth harmonic frequency band. By applying this concept, power noise suppression can be guaranteed with small area for various applications of the more high-speed digital circuits such as USB 3.0, SATA 3.0 or etc.
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U2 - 10.1109/EDAPS.2011.6213732
DO - 10.1109/EDAPS.2011.6213732
M3 - Conference contribution
AN - SCOPUS:84864226271
SN - 9781467322881
T3 - 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
BT - 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
T2 - 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
Y2 - 12 December 2011 through 14 December 2011
ER -