Polyimide/organosilicate nanocomposites: Residual stress behavior on Si wafer for multichip packaging

Due to rise in demand for mobile devices, development of complex stacked packaging technology such as multi-chip package, capable of both small size and high volume, are in high interest. As residual stress of individual chips increases, the degree of bending rises leading to more difficulty in package assembly process and decreased reliability of the final package product. To overcome this, deeper understanding of the thermal history and thermal behavior between the polymer film and substrates are needed. In this work, residual stress-temperature profiles of thermally stable polyimide/organically-modified layered silicate (PI/OLS) nanocomposite systems on Si wafer were investigated in situ during imidization and cooling process. This study provides systematic approach from the perspective of substrate design for multi-stacked semiconductor package.