Abstract
We demonstrate that graphene can enhance the etch resistance of polymeric hardmask significantly. Graphene oxide with a sub-micrometer diameter (nGO) was functionalized with fluorinated poly(hydroxyamide) (FPHA) via a chemical coupling reaction. The FPHA-functionalized-nGO can be dispersed in various organic solvents including methanol, cyclohexanone, dimethylformamide, and N-methyl pyrrolidone. In addition, the dispersions were spincoated to prepare hardmask films which were then thermally annealed to produce nRGO-fluorinated-polybenzoxazole (FPBO) film. Compared to pristine FPBO film, elastic modulus (122%), hardness (92%), and etch resistance (54%) were significantly enhanced at 17 wt.% graphene loading, surpassing the properties of commercial CHM009 film.
| Original language | English |
|---|---|
| Pages (from-to) | 296-303 |
| Number of pages | 8 |
| Journal | Journal of Industrial and Engineering Chemistry |
| Volume | 75 |
| DOIs | |
| Publication status | Published - 2019 Jul 25 |
Bibliographical note
Funding Information:This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (2015R1A6A3A04057367). The authors declare no conflict of interest.
Funding Information:
This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education ( 2015R1A6A3A04057367 ). The authors declare no conflict of interest.
Publisher Copyright:
© 2019 The Korean Society of Industrial and Engineering Chemistry
All Science Journal Classification (ASJC) codes
- Chemical Engineering(all)