Plasma deposition of parylene-C film

Zhiquan Song, Ju Hee Im, Hyuk Ko, Jun Hee Park, Ga Yeon Lee, Min Jung Kang, Moo Hwan Kim, Jae Chul Pyun

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)


A new method that uses plasma energy for the deposition of parylene-C films is presented. The equipment and instrumentation for the plasma deposition of parylene-C films were developed and constructed by combining evaporation and plasma-generating units. The plasma deposition of parylene-C films consists of three steps: evaporation, decomposition of the parylene-C dimers using plasma, and deposition of the film. The entire deposition process from evaporation to deposition was designed to be completed within 20 min for a parylene-C film with a thickness of less than 200 nm. The thickness of the parylene-C film was controlled in the range of 100–200 nm by adjusting the amount of parylene-C dimer as well as the plasma energy. The parylene-C films prepared by plasma deposition were characterized and compared with those obtained using the conventional pyrolysis method. The comparison included the chemical properties (chemical functional groups, atomic compositions) and their physical properties (density, crystallinity, absorption in the visible wavelength range, surface roughness and contact angle).

Original languageEnglish
Article number101834
JournalMaterials Today Communications
Publication statusPublished - 2021 Mar

Bibliographical note

Publisher Copyright:
© 2020 Elsevier Ltd

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Mechanics of Materials
  • Materials Chemistry


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