Planarization and trench filling on severe surface topography with thick photoresist for MEMS

Jun Bo Yoon; Gilbert Y. Oh; Chul Hi Han; Euisik Yoon; Choong Ki Kim

doi:10.1117/12.324314

Planarization and trench filling on severe surface topography with thick photoresist for MEMS

Jun Bo Yoon, Gilbert Y. Oh, Chul Hi Han, Euisik Yoon, Choong Ki Kim

Yonsei Advanced Science Institute

Research output: Contribution to journal › Conference article › peer-review

Abstract

Thick photoresist and polyimide were applied to planarization and trench filling on a severe surface topography for MEMS. The 10∼100μm-thick film was tried to planarize surface steps of up to 20μm-deep and 200μwide L&S. The resultant data were analyzed in detail.

Original language	English
Pages (from-to)	297-306
Number of pages	10
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	3511
DOIs	https://doi.org/10.1117/12.324314
Publication status	Published - 1998
Event	Micromachining and Microfabrication Process Technology IV - Santa Clara, CA, United States Duration: 1998 Sept 21 → 1998 Sept 22

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.324314

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title = "Planarization and trench filling on severe surface topography with thick photoresist for MEMS",

abstract = "Thick photoresist and polyimide were applied to planarization and trench filling on a severe surface topography for MEMS. The 10∼100μm-thick film was tried to planarize surface steps of up to 20μm-deep and 200μwide L&S. The resultant data were analyzed in detail.",

author = "Yoon, {Jun Bo} and Oh, {Gilbert Y.} and Han, {Chul Hi} and Euisik Yoon and Kim, {Choong Ki}",

year = "1998",

doi = "10.1117/12.324314",

language = "English",

volume = "3511",

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journal = "Proceedings of SPIE - The International Society for Optical Engineering",

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AU - Yoon, Jun Bo

AU - Oh, Gilbert Y.

AU - Han, Chul Hi

AU - Yoon, Euisik

AU - Kim, Choong Ki

PY - 1998

Y1 - 1998

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AB - Thick photoresist and polyimide were applied to planarization and trench filling on a severe surface topography for MEMS. The 10∼100μm-thick film was tried to planarize surface steps of up to 20μm-deep and 200μwide L&S. The resultant data were analyzed in detail.

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EP - 306

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Micromachining and Microfabrication Process Technology IV

Y2 - 21 September 1998 through 22 September 1998

ER -

Planarization and trench filling on severe surface topography with thick photoresist for MEMS

Abstract

All Science Journal Classification (ASJC) codes

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