Package-level integrated LTCC antenna for RF package application

Sang Hyuk Wi; Jin Seok Kim; Nam Kee Kang; Jun Chul Kim; Hoon Gee Yang; Young Soo Kim; Jong Gwan Yook

doi:10.1109/TADVP.2006.890216

Package-level integrated LTCC antenna for RF package application

Sang Hyuk Wi, Jin Seok Kim, Nam Kee Kang, Jun Chul Kim, Hoon Gee Yang, Young Soo Kim, Jong Gwan Yook

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

38 Citations (Scopus)

Abstract

This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics.

Original language	English
Pages (from-to)	132-141
Number of pages	10
Journal	IEEE Transactions on Advanced Packaging
Volume	30
Issue number	1
DOIs	https://doi.org/10.1109/TADVP.2006.890216
Publication status	Published - 2007 Feb

Bibliographical note

Funding Information:
Manuscript received December 2, 2005; revised March 7, 2006 and May 15, 2006. This work was supported in part by the Yonsei University Research Fund of 2000 and in part by the Ministry of Information and Communication, Republic of Korea, with the Information Technology Research Center support program under Grant IITA-2005-C1090-0502-0012. S.-H. Wi and J.-G. Yook are with the Department of Electrical and Electronic Engineering, Yonsei University, Seoul 120-749, Korea (e-mail: wshnury@yonsei.ac.kr; jgyook@yonsei.ac.kr). J.-S. Kim is with LG Electronics, Seoul 153-023, Korea. N.-K. Kang and J.-C. Kim are with the Korea Electronics Technology Institute, Sungnam 463-816, Korea. H.-G. Yang is with Department of Radio Science and Engineering, Kwang-woon University, Seoul 139-701, Korea. Y.-S. Kim is with Department of Radio Engineering, Kyunghee University, Yongin 446-701, Korea. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TADVP.2006.890216

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1109/TADVP.2006.890216

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title = "Package-level integrated LTCC antenna for RF package application",

abstract = "This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics.",

author = "Wi, {Sang Hyuk} and Kim, {Jin Seok} and Kang, {Nam Kee} and Kim, {Jun Chul} and Yang, {Hoon Gee} and Kim, {Young Soo} and Yook, {Jong Gwan}",

note = "Funding Information: Manuscript received December 2, 2005; revised March 7, 2006 and May 15, 2006. This work was supported in part by the Yonsei University Research Fund of 2000 and in part by the Ministry of Information and Communication, Republic of Korea, with the Information Technology Research Center support program under Grant IITA-2005-C1090-0502-0012. S.-H. Wi and J.-G. Yook are with the Department of Electrical and Electronic Engineering, Yonsei University, Seoul 120-749, Korea (e-mail: wshnury@yonsei.ac.kr; jgyook@yonsei.ac.kr). J.-S. Kim is with LG Electronics, Seoul 153-023, Korea. N.-K. Kang and J.-C. Kim are with the Korea Electronics Technology Institute, Sungnam 463-816, Korea. H.-G. Yang is with Department of Radio Science and Engineering, Kwang-woon University, Seoul 139-701, Korea. Y.-S. Kim is with Department of Radio Engineering, Kyunghee University, Yongin 446-701, Korea. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TADVP.2006.890216",

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N2 - This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics.

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Package-level integrated LTCC antenna for RF package application

Abstract

Bibliographical note

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