Package-level integrated antennas based on LTCC technology

Sang Hyuk Wi; Yong Bin Sun; In Sang Song; Sung Hoon Choa; Il Suek Koh; Yong Shik Lee; Jong Gwan Yook

doi:10.1109/TAP.2006.879191

Package-level integrated antennas based on LTCC technology

Sang Hyuk Wi, Yong Bin Sun, In Sang Song, Sung Hoon Choa, Il Suek Koh, Yong Shik Lee, Jong Gwan Yook

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

97 Citations (Scopus)

Abstract

We propose a novel package topology integrating multilayer miniaturized antennas. Such a functional package is suitable for the design of a system-on-chip device, or of system-on-package applications. A stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic process. The overall size of the package is 10.3 × 10.3 × 1.3 mm³, and this package contains an 8.3 × 8.3 × 0.7 mm³ internal space for the integration of chip-scale packaged components. The package is mounted on a 20 × 20 mm² ground plane to miniaturize the volume of the system. The antenna is designed to have two neighboring resonant frequencies at 5.264 and 5.355 GHz, resulting in a 140 MHz impedance bandwidth. However, the measured resonant frequencies occur at slightly higher frequencies due to manufacturing tolerances. Radiation patterns are similar to a conventional patch antenna. In addition, various parasitic effects rooted in the package size, ground size, antenna height, SMA connector, via misalignment, and the number of via holes and their locations are fully investigated.

Original language	English
Pages (from-to)	2190-2197
Number of pages	8
Journal	IEEE Transactions on Antennas and Propagation
Volume	54
Issue number	8
DOIs	https://doi.org/10.1109/TAP.2006.879191
Publication status	Published - 2006 Aug

Bibliographical note

Funding Information:
Manuscript received June 7, 2005; revised May 13, 2006. This work was supported in part by the Center for Advanced Transceiver Systems and Information Technology Research Center (CARUT) under Grant IITA-2005-C1090-0502-0012. S.-H. Wi, Y.-S. Lee and J.-G. Yook are with the Department of Electrical and Electronic Engineering, Yonsei University, Seoul 120-749, Korea (e-mail: wshnury@yonsei.ac.kr; jgyook@yonsei.ac.kr). Y.-B. Sun is with Graduate School of Industrial and Information Technology, Kyonggi University, Suwon 443-760, Korea. I.-S. Song and S.-H. Choa are with Samsung Advanced Institute of Technology, Yongin 446-712, Korea. I.-S. Koh is with Graduate School of Information Technology and Telecommunications, Inha University, Incheon 402-751, Korea. Digital Object Identifier 10.1109/TAP.2006.879191

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1109/TAP.2006.879191

Cite this

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title = "Package-level integrated antennas based on LTCC technology",

abstract = "We propose a novel package topology integrating multilayer miniaturized antennas. Such a functional package is suitable for the design of a system-on-chip device, or of system-on-package applications. A stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic process. The overall size of the package is 10.3 × 10.3 × 1.3 mm3, and this package contains an 8.3 × 8.3 × 0.7 mm3 internal space for the integration of chip-scale packaged components. The package is mounted on a 20 × 20 mm2 ground plane to miniaturize the volume of the system. The antenna is designed to have two neighboring resonant frequencies at 5.264 and 5.355 GHz, resulting in a 140 MHz impedance bandwidth. However, the measured resonant frequencies occur at slightly higher frequencies due to manufacturing tolerances. Radiation patterns are similar to a conventional patch antenna. In addition, various parasitic effects rooted in the package size, ground size, antenna height, SMA connector, via misalignment, and the number of via holes and their locations are fully investigated.",

author = "Wi, {Sang Hyuk} and Sun, {Yong Bin} and Song, {In Sang} and Choa, {Sung Hoon} and Koh, {Il Suek} and Lee, {Yong Shik} and Yook, {Jong Gwan}",

note = "Funding Information: Manuscript received June 7, 2005; revised May 13, 2006. This work was supported in part by the Center for Advanced Transceiver Systems and Information Technology Research Center (CARUT) under Grant IITA-2005-C1090-0502-0012. S.-H. Wi, Y.-S. Lee and J.-G. Yook are with the Department of Electrical and Electronic Engineering, Yonsei University, Seoul 120-749, Korea (e-mail: wshnury@yonsei.ac.kr; jgyook@yonsei.ac.kr). Y.-B. Sun is with Graduate School of Industrial and Information Technology, Kyonggi University, Suwon 443-760, Korea. I.-S. Song and S.-H. Choa are with Samsung Advanced Institute of Technology, Yongin 446-712, Korea. I.-S. Koh is with Graduate School of Information Technology and Telecommunications, Inha University, Incheon 402-751, Korea. Digital Object Identifier 10.1109/TAP.2006.879191",

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AU - Yook, Jong Gwan

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N2 - We propose a novel package topology integrating multilayer miniaturized antennas. Such a functional package is suitable for the design of a system-on-chip device, or of system-on-package applications. A stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic process. The overall size of the package is 10.3 × 10.3 × 1.3 mm3, and this package contains an 8.3 × 8.3 × 0.7 mm3 internal space for the integration of chip-scale packaged components. The package is mounted on a 20 × 20 mm2 ground plane to miniaturize the volume of the system. The antenna is designed to have two neighboring resonant frequencies at 5.264 and 5.355 GHz, resulting in a 140 MHz impedance bandwidth. However, the measured resonant frequencies occur at slightly higher frequencies due to manufacturing tolerances. Radiation patterns are similar to a conventional patch antenna. In addition, various parasitic effects rooted in the package size, ground size, antenna height, SMA connector, via misalignment, and the number of via holes and their locations are fully investigated.

AB - We propose a novel package topology integrating multilayer miniaturized antennas. Such a functional package is suitable for the design of a system-on-chip device, or of system-on-package applications. A stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic process. The overall size of the package is 10.3 × 10.3 × 1.3 mm3, and this package contains an 8.3 × 8.3 × 0.7 mm3 internal space for the integration of chip-scale packaged components. The package is mounted on a 20 × 20 mm2 ground plane to miniaturize the volume of the system. The antenna is designed to have two neighboring resonant frequencies at 5.264 and 5.355 GHz, resulting in a 140 MHz impedance bandwidth. However, the measured resonant frequencies occur at slightly higher frequencies due to manufacturing tolerances. Radiation patterns are similar to a conventional patch antenna. In addition, various parasitic effects rooted in the package size, ground size, antenna height, SMA connector, via misalignment, and the number of via holes and their locations are fully investigated.

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JF - IEEE Transactions on Antennas and Propagation

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ER -

Package-level integrated antennas based on LTCC technology

Abstract

Bibliographical note

All Science Journal Classification (ASJC) codes

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