Abstract
Novel Al2O3 process was developed in order to extend the applicability of reliable SIS and MIS Al2O3 capacitors as well as Al2O3 EBL for a MIM capacitor. By applying ALD process utilizing a smart growth mechanism, electrical and interfacial properties of Al2O3 film were surprisingly improved. The SIS and MIS Al2O3 capacitor technologies with ultra-low thermal budget were confirmed by producing fully working 1Gbit DRAM with design rule of 0.15 and 0.13μm, respectively. Moreover, Al2O3 EBL for a MIM capacitor was successfully working to preserve the excellent dielectric characteristics for the application of DRAM with design-rule of 0.10 μm, and beyonds.
Original language | English |
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Pages (from-to) | 369-372 |
Number of pages | 4 |
Journal | Technical Digest - International Electron Devices Meeting |
DOIs | |
Publication status | Published - 2000 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry