Abstract
A novel and high-yield process is presented to fabricate electroplated 3D micro-coils for MEMS and microelectronics. The 3D Solenoid-type Integrated Inductor (SI2) is decomposed into two parts, bottom conductor lines and air bridges. The bridges are formed by only one electroplating step. This single-step fabrication of the electroplated air bridges is possible by forming the 3D photoresist mold with a Multi-Exposure and Single Development method (MESD). We have successfully demonstrated 3D micro-coils with or without a core. This method is so easy and simple that we can dramatically improve the fabrication yield, which is the hardest obstacle in the various 3D micro-coil fabrication methods. Also, this method has good IC process compatibility owing to low process temperature and the monolithic feature.
| Original language | English |
|---|---|
| Pages (from-to) | 233-240 |
| Number of pages | 8 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3511 |
| DOIs | |
| Publication status | Published - 1998 |
| Event | Micromachining and Microfabrication Process Technology IV - Santa Clara, CA, United States Duration: 1998 Sept 21 → 1998 Sept 22 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering