New current-mode sense amplifiers for high density DRAM and PIM architectures

S. M. Yo; C. Kim; S. O. Jung; K. H. Baek; S. M. Kang

New current-mode sense amplifiers for high density DRAM and PIM architectures

S. M. Yo, C. Kim, S. O. Jung, K. H. Baek, S. M. Kang

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Conference article › peer-review

1 Citation (Scopus)

Abstract

This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.

Original language	English
Pages (from-to)	IV938-IV941
Journal	Materials Research Society Symposium - Proceedings
Volume	626
Publication status	Published - 2001
Event	Thermoelectric Materials 2000-The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications - San Francisco, CA, United States Duration: 2000 Apr 24 → 2000 Apr 27

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Cite this

@article{d571d83f206f4bbc85d986a5503c1df2,

title = "New current-mode sense amplifiers for high density DRAM and PIM architectures",

abstract = "This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.",

author = "Yo, {S. M.} and C. Kim and Jung, {S. O.} and Baek, {K. H.} and Kang, {S. M.}",

year = "2001",

language = "English",

volume = "626",

pages = "IV938--IV941",

journal = "Materials Research Society Symposium - Proceedings",

issn = "0272-9172",

publisher = "Materials Research Society",

note = "Thermoelectric Materials 2000-The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications ; Conference date: 24-04-2000 Through 27-04-2000",

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TY - JOUR

T1 - New current-mode sense amplifiers for high density DRAM and PIM architectures

AU - Yo, S. M.

AU - Kim, C.

AU - Jung, S. O.

AU - Baek, K. H.

AU - Kang, S. M.

PY - 2001

Y1 - 2001

N2 - This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.

AB - This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.

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UR - http://www.scopus.com/inward/citedby.url?scp=0035036553&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0035036553

SN - 0272-9172

VL - 626

SP - IV938-IV941

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Thermoelectric Materials 2000-The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications

Y2 - 24 April 2000 through 27 April 2000

ER -

New current-mode sense amplifiers for high density DRAM and PIM architectures

Abstract

All Science Journal Classification (ASJC) codes

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