Nanotransfer printing by use of noncovalent surface forces: Applications to thin-film transistors that use single-walled carbon nanotube networks and semiconducting polymers

Seung Hyun Hur; Dahl Young Khang; Coskun Kocabas; John A. Rogers

doi:10.1063/1.1829774

Nanotransfer printing by use of noncovalent surface forces: Applications to thin-film transistors that use single-walled carbon nanotube networks and semiconducting polymers

Seung Hyun Hur, Dahl Young Khang, Coskun Kocabas, John A. Rogers

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

107 Citations (Scopus)

Abstract

We report a purely additive nanotransfer printing process that uses noncovalent surface forces to guide the transfer of thin metal films from low-energy surfaces of high-resolution stamps to a variety of substrates. Structures with dimensions as small as a few hundred nanometers, with edge roughness as small as 10 nm are demonstrated. Metal multilayer stacks patterned in this way have electrical resistances that are the same as those formed by evaporation and conventional lithography. Thin-film transistors that use source/drain electrodes printed directly onto thin films of the semiconducting polymer regioregular polythiophene and networks of single-walled carbon nanotubes exhibit device mobilities and on/off ratios that are comparable to or higher than those of devices fabricated using standard methods.

Original language	English
Pages (from-to)	5730-5732
Number of pages	3
Journal	Applied Physics Letters
Volume	85
Issue number	23
DOIs	https://doi.org/10.1063/1.1829774
Publication status	Published - 2004 Dec 6

Bibliographical note

Funding Information:
The authors thank T. Banks for help with the process and A. Shim of Dow Corning for helpful discussions. This work was supported by DARPA-funded AFRL-managed Macroelectronics Program (FA8650-04-C-7101). Funding is also partially provided by the U.S. Department of Energy under Grant No. DEFG02-91-ER45439. S.-H.H. and D.-Y.K. thank the Korea Science and Engineering Foundation (KOSEF) for the financial support.

All Science Journal Classification (ASJC) codes

Physics and Astronomy (miscellaneous)

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10.1063/1.1829774

Cite this

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title = "Nanotransfer printing by use of noncovalent surface forces: Applications to thin-film transistors that use single-walled carbon nanotube networks and semiconducting polymers",

abstract = "We report a purely additive nanotransfer printing process that uses noncovalent surface forces to guide the transfer of thin metal films from low-energy surfaces of high-resolution stamps to a variety of substrates. Structures with dimensions as small as a few hundred nanometers, with edge roughness as small as 10 nm are demonstrated. Metal multilayer stacks patterned in this way have electrical resistances that are the same as those formed by evaporation and conventional lithography. Thin-film transistors that use source/drain electrodes printed directly onto thin films of the semiconducting polymer regioregular polythiophene and networks of single-walled carbon nanotubes exhibit device mobilities and on/off ratios that are comparable to or higher than those of devices fabricated using standard methods.",

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Nanotransfer printing by use of noncovalent surface forces: Applications to thin-film transistors that use single-walled carbon nanotube networks and semiconducting polymers. / Hur, Seung Hyun; Khang, Dahl Young; Kocabas, Coskun et al.
In: Applied Physics Letters, Vol. 85, No. 23, 06.12.2004, p. 5730-5732.

Research output: Contribution to journal › Article › peer-review

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AU - Kocabas, Coskun

AU - Rogers, John A.

N1 - Funding Information: The authors thank T. Banks for help with the process and A. Shim of Dow Corning for helpful discussions. This work was supported by DARPA-funded AFRL-managed Macroelectronics Program (FA8650-04-C-7101). Funding is also partially provided by the U.S. Department of Energy under Grant No. DEFG02-91-ER45439. S.-H.H. and D.-Y.K. thank the Korea Science and Engineering Foundation (KOSEF) for the financial support.

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AB - We report a purely additive nanotransfer printing process that uses noncovalent surface forces to guide the transfer of thin metal films from low-energy surfaces of high-resolution stamps to a variety of substrates. Structures with dimensions as small as a few hundred nanometers, with edge roughness as small as 10 nm are demonstrated. Metal multilayer stacks patterned in this way have electrical resistances that are the same as those formed by evaporation and conventional lithography. Thin-film transistors that use source/drain electrodes printed directly onto thin films of the semiconducting polymer regioregular polythiophene and networks of single-walled carbon nanotubes exhibit device mobilities and on/off ratios that are comparable to or higher than those of devices fabricated using standard methods.

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Nanotransfer printing by use of noncovalent surface forces: Applications to thin-film transistors that use single-walled carbon nanotube networks and semiconducting polymers

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