Multi-view tof sensor fusion technique for high quality depth map

Deukhyeon Kim, Jinwook Choi, Kwanghoon Sohn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


The Time-of-Flight (ToF) sensor has been widely used in computer vision fields since it can provide depth information in real time. However, the depth map obtained from ToF sensor is distressed with error, and has a lower resolution than general cameras. In this paper, we propose a novel framework to fuse and upsample multi-view depth maps obtained from multiple ToF sensors. The proposed method can be robust to the camera calibration error and effectively applied to the Multi-view Video plus Depth (MVD) system. For that, we perform depth balancing and confidence map based multi-view depth fusion. The depth balancing adjusts the distribution of depth values between multiple ToF sensors. It can provide a coherent depth for the corresponding points between depth maps. Confidence map based multi-view depth fusion technique can restore the depth acquisition error and align multiple depth maps well with the corresponding color image by using only reliable depth values. Experimental results show that the proposed method using multiple ToF sensors is superior to the conventional method based on the 2D-plus-depth system consisting of one color camera and one depth sensor.

Original languageEnglish
Title of host publicationProceedings of SPIE-IS and T Electronic Imaging - Three-Dimensional Image Processing (3DIP) and Applications 2013
Publication statusPublished - 2013
EventThree-Dimensional Image Processing (3DIP) and Applications 2013 - Burlingame, CA, United States
Duration: 2013 Feb 62013 Feb 7

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherThree-Dimensional Image Processing (3DIP) and Applications 2013
Country/TerritoryUnited States
CityBurlingame, CA

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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