Abstract
A new monolithic integration method for 3-D electroplated microstructures of unlimited number of levels has been developed using unique planarization with a sacrificial metallic mold (PSMM). Contrary to the conventional electroplating mold of photoresist or polyimide, the sacrificial metallic mold (SMM) is used for multiple functions: a sacrificial layer, a planarization layer, and a seed layer for the next-level electroplating as well. We have successfully demonstrated various three-level metallic microstructures, such as levitated on-chip inductors, micro-bridges, micro-cantilevers, and micro-mirrors. The RF performance of the fabricated inductor has shown excellent results of 5 nH, Q-factor of 50 at 5 GHz on glass. This method is very simple, highly adaptable, and IC-compatible, so that it can be used as a versatile tool to integrate various 3-D metallic microstructures in multiple levels.
| Original language | English |
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| Pages | 624-629 |
| Number of pages | 6 |
| Publication status | Published - 1999 |
| Event | Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS - Orlando, FL, USA Duration: 1999 Jan 17 → 1999 Jan 21 |
Conference
| Conference | Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS |
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| City | Orlando, FL, USA |
| Period | 99/1/17 → 99/1/21 |
All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Mechanical Engineering
- Electrical and Electronic Engineering