TY - JOUR
T1 - Modeling O/E characteristics of 40-Gb/s InGaAs side-illuminated waveguide photodiode submodule for optical receivers
AU - Lee, Bongyong
AU - Jeon, Su Chang
AU - Yoon, Hongil
AU - Choe, Joong Seon
AU - Kwon, Yong Hwan
AU - Yun, Ilgu
PY - 2006/8
Y1 - 2006/8
N2 - In this paper, the circuit models of a waveguide photodiode (WGPD) and its submodule were investigated, and the O/E characteristics of a WGPD submodule are examined. Test structures of the WGPD and WGPD submodule were fabricated and microwave return loss (S11) was measured and compared with simulated data to validate the circuit models. With the established submodule model, optical to electrical (O/E) characteristics were measured and compared with the modeled data to analyze the effects of model parameters on the submodule performance. Based on the results, it can be concluded that the suggested submodule model can explain the characteristics of the submodule performance. In addition, parasitic components that originated from the ribbon bonding block can crucially impact on the performance of WGPD submodule.
AB - In this paper, the circuit models of a waveguide photodiode (WGPD) and its submodule were investigated, and the O/E characteristics of a WGPD submodule are examined. Test structures of the WGPD and WGPD submodule were fabricated and microwave return loss (S11) was measured and compared with simulated data to validate the circuit models. With the established submodule model, optical to electrical (O/E) characteristics were measured and compared with the modeled data to analyze the effects of model parameters on the submodule performance. Based on the results, it can be concluded that the suggested submodule model can explain the characteristics of the submodule performance. In addition, parasitic components that originated from the ribbon bonding block can crucially impact on the performance of WGPD submodule.
KW - Circuit model
KW - Optical receiver module
KW - Optical to electrical (O/E) response
KW - Waveguide photodiodes (WGPDs)
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U2 - 10.1109/TADVP.2006.875405
DO - 10.1109/TADVP.2006.875405
M3 - Article
AN - SCOPUS:33747697858
SN - 1521-3323
VL - 29
SP - 488
EP - 495
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 3
ER -