Microtechnology in the development of three-dimensional circuits

Katherine J. Herrick, Jong Gwan Yook, Linda P.B. Katehi

Research output: Contribution to journalArticlepeer-review

61 Citations (Scopus)


With today's cost-conscience industry, low-cost, high-performance, and high-profit microwave-circuit technologies are essential. To increase density and reduce size and cost, the integration of analog and digital circuits on one single chip is considered the most viable solution. In reducing the size of the overall system, high-density integration (HDI) and packaging have become critical components in circuit design. This paper reviews and evaluates state-of-the-art planar transmission lines and vertical interconnects for use in high-density multilayer circuits for silicon- and SiGe-based monolithic high-frequency circuits. Packaging issues associated with parasitics will be discussed and examples of multilayer three-dimensional systems utilizing micromachining will be presented.

Original languageEnglish
Pages (from-to)1832-1844
Number of pages13
JournalIEEE Transactions on Microwave Theory and Techniques
Issue number11 PART 2
Publication statusPublished - 1998

Bibliographical note

Funding Information:
Manuscript received July 27, 1998; revised August 20, 1998. This work was supported by the U.S. Army Research Office under Contract DAAH04-96-1-0390, by the Jet Propulsion Laboratory under Contract # 961301, and by DARPA/Hughes under Contract FR-573420-SR8.

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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