Microtechnology in the development of three-dimensional circuits

Katherine J. Herrick; Jong Gwan Yook; Linda P.B. Katehi

doi:10.1109/22.734496

Microtechnology in the development of three-dimensional circuits

Katherine J. Herrick, Jong Gwan Yook, Linda P.B. Katehi

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

61 Citations (Scopus)

Abstract

With today's cost-conscience industry, low-cost, high-performance, and high-profit microwave-circuit technologies are essential. To increase density and reduce size and cost, the integration of analog and digital circuits on one single chip is considered the most viable solution. In reducing the size of the overall system, high-density integration (HDI) and packaging have become critical components in circuit design. This paper reviews and evaluates state-of-the-art planar transmission lines and vertical interconnects for use in high-density multilayer circuits for silicon- and SiGe-based monolithic high-frequency circuits. Packaging issues associated with parasitics will be discussed and examples of multilayer three-dimensional systems utilizing micromachining will be presented.

Original language	English
Pages (from-to)	1832-1844
Number of pages	13
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	46
Issue number	11 PART 2
DOIs	https://doi.org/10.1109/22.734496
Publication status	Published - 1998

Bibliographical note

Funding Information:
Manuscript received July 27, 1998; revised August 20, 1998. This work was supported by the U.S. Army Research Office under Contract DAAH04-96-1-0390, by the Jet Propulsion Laboratory under Contract # 961301, and by DARPA/Hughes under Contract FR-573420-SR8.

All Science Journal Classification (ASJC) codes

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/22.734496

Cite this

@article{b0cc11e1e6f74e76b34e6ad2fb0d27e4,

title = "Microtechnology in the development of three-dimensional circuits",

abstract = "With today's cost-conscience industry, low-cost, high-performance, and high-profit microwave-circuit technologies are essential. To increase density and reduce size and cost, the integration of analog and digital circuits on one single chip is considered the most viable solution. In reducing the size of the overall system, high-density integration (HDI) and packaging have become critical components in circuit design. This paper reviews and evaluates state-of-the-art planar transmission lines and vertical interconnects for use in high-density multilayer circuits for silicon- and SiGe-based monolithic high-frequency circuits. Packaging issues associated with parasitics will be discussed and examples of multilayer three-dimensional systems utilizing micromachining will be presented.",

author = "Herrick, {Katherine J.} and Yook, {Jong Gwan} and Katehi, {Linda P.B.}",

note = "Funding Information: Manuscript received July 27, 1998; revised August 20, 1998. This work was supported by the U.S. Army Research Office under Contract DAAH04-96-1-0390, by the Jet Propulsion Laboratory under Contract # 961301, and by DARPA/Hughes under Contract FR-573420-SR8.",

year = "1998",

doi = "10.1109/22.734496",

language = "English",

volume = "46",

pages = "1832--1844",

journal = "IEEE Transactions on Microwave Theory and Techniques",

issn = "0018-9480",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "11 PART 2",

}

TY - JOUR

T1 - Microtechnology in the development of three-dimensional circuits

AU - Herrick, Katherine J.

AU - Yook, Jong Gwan

AU - Katehi, Linda P.B.

N1 - Funding Information: Manuscript received July 27, 1998; revised August 20, 1998. This work was supported by the U.S. Army Research Office under Contract DAAH04-96-1-0390, by the Jet Propulsion Laboratory under Contract # 961301, and by DARPA/Hughes under Contract FR-573420-SR8.

PY - 1998

Y1 - 1998

N2 - With today's cost-conscience industry, low-cost, high-performance, and high-profit microwave-circuit technologies are essential. To increase density and reduce size and cost, the integration of analog and digital circuits on one single chip is considered the most viable solution. In reducing the size of the overall system, high-density integration (HDI) and packaging have become critical components in circuit design. This paper reviews and evaluates state-of-the-art planar transmission lines and vertical interconnects for use in high-density multilayer circuits for silicon- and SiGe-based monolithic high-frequency circuits. Packaging issues associated with parasitics will be discussed and examples of multilayer three-dimensional systems utilizing micromachining will be presented.

AB - With today's cost-conscience industry, low-cost, high-performance, and high-profit microwave-circuit technologies are essential. To increase density and reduce size and cost, the integration of analog and digital circuits on one single chip is considered the most viable solution. In reducing the size of the overall system, high-density integration (HDI) and packaging have become critical components in circuit design. This paper reviews and evaluates state-of-the-art planar transmission lines and vertical interconnects for use in high-density multilayer circuits for silicon- and SiGe-based monolithic high-frequency circuits. Packaging issues associated with parasitics will be discussed and examples of multilayer three-dimensional systems utilizing micromachining will be presented.

UR - http://www.scopus.com/inward/record.url?scp=0032206780&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032206780&partnerID=8YFLogxK

U2 - 10.1109/22.734496

DO - 10.1109/22.734496

M3 - Article

AN - SCOPUS:0032206780

SN - 0018-9480

VL - 46

SP - 1832

EP - 1844

JO - IEEE Transactions on Microwave Theory and Techniques

JF - IEEE Transactions on Microwave Theory and Techniques

IS - 11 PART 2

ER -

Microtechnology in the development of three-dimensional circuits

Abstract

Bibliographical note

All Science Journal Classification (ASJC) codes

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