Microstructure and fracture toughness of in-situ toughened SiC-TiC composites

Kyeong Sik Cho; Heon Jin Choi; June Gunn Lee; Young Wook Kim

doi:10.1023/A:1006671713994

Microstructure and fracture toughness of in-situ toughened SiC-TiC composites

Kyeong Sik Cho, Heon Jin Choi, June Gunn Lee, Young Wook Kim

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

16 Citations (Scopus)

Original language	English
Pages (from-to)	1081-1084
Number of pages	4
Journal	Journal of Materials Science Letters
Volume	17
Issue number	13
DOIs	https://doi.org/10.1023/A:1006671713994
Publication status	Published - 1998

All Science Journal Classification (ASJC) codes

Materials Science(all)

Access to Document

10.1023/A:1006671713994

Cite this

@article{e52ff831d60840b48ecbe2d207bcd950,

title = "Microstructure and fracture toughness of in-situ toughened SiC-TiC composites",

author = "Cho, {Kyeong Sik} and Choi, {Heon Jin} and Lee, {June Gunn} and Kim, {Young Wook}",

year = "1998",

doi = "10.1023/A:1006671713994",

language = "English",

volume = "17",

pages = "1081--1084",

journal = "Journal of Materials Science Letters",

issn = "0261-8028",

publisher = "Chapman & Hall",

number = "13",

}

TY - JOUR

T1 - Microstructure and fracture toughness of in-situ toughened SiC-TiC composites

AU - Cho, Kyeong Sik

AU - Choi, Heon Jin

AU - Lee, June Gunn

AU - Kim, Young Wook

PY - 1998

Y1 - 1998

UR - http://www.scopus.com/inward/record.url?scp=0032108335&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032108335&partnerID=8YFLogxK

U2 - 10.1023/A:1006671713994

DO - 10.1023/A:1006671713994

M3 - Article

AN - SCOPUS:0032108335

SN - 0261-8028

VL - 17

SP - 1081

EP - 1084

JO - Journal of Materials Science Letters

JF - Journal of Materials Science Letters

IS - 13

ER -

Microstructure and fracture toughness of in-situ toughened SiC-TiC composites

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Cite this