TY - JOUR
T1 - Microstructural modulations enhance the mechanical properties in Al-Cu-(Si, Ga) ultrafine composites
AU - Park, Jin Man
AU - Pauly, Simon
AU - Mattern, Norbert
AU - Kim, Do Hyang
AU - Kim, Ki Buem
AU - Eckert, Jürgen
PY - 2010/11
Y1 - 2010/11
N2 - Adding small amounts of Si or Ga (3 at.%) to the eutectic Al 83Cu17 alloy yields an ultrafine bimodal eutectic composite microstructure upon solidification. The as-solidified alloys exhibit a distinct microstructural length-scale hierarchy leading to a high fracture strength of around 1 GPa combined with a large compressive plastic strain of up to 30% at room temperature. The present results suggest that the mechanical properties of the ultrafine bimodal eutectic composites are strongly related to their microstructural characteristics, namely phase evolution, length-scales, and distribution of the constituent phases.
AB - Adding small amounts of Si or Ga (3 at.%) to the eutectic Al 83Cu17 alloy yields an ultrafine bimodal eutectic composite microstructure upon solidification. The as-solidified alloys exhibit a distinct microstructural length-scale hierarchy leading to a high fracture strength of around 1 GPa combined with a large compressive plastic strain of up to 30% at room temperature. The present results suggest that the mechanical properties of the ultrafine bimodal eutectic composites are strongly related to their microstructural characteristics, namely phase evolution, length-scales, and distribution of the constituent phases.
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U2 - 10.1002/adem.201000155
DO - 10.1002/adem.201000155
M3 - Article
AN - SCOPUS:78649874055
SN - 1438-1656
VL - 12
SP - 1137
EP - 1141
JO - Advanced Engineering Materials
JF - Advanced Engineering Materials
IS - 11
ER -