Micromachined cascade virtual impactor for aerodynamic size classification of airborne particles

Jwa Young Maeng, Dongho Park, Yong Ho Kim, Jungho Hwang, Yone Jun Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

We report design, fabrication and experimental results of a micromachined cascade virtual impactor with flow rate distributor for classifying airborne particles according to their sizes. The fabricated device consists of two components: a cascade virtual impactor for classifying particles according to their own inertia, and a flow rate distributor to maintain specific flow rates at each channel. Proposed device is fabricated using polymer-based micromachining. Due to the flow rate distributor, only one external pump was used for controlling major flow rates and minor flow rates. DOS particles ranged from 100 to 600 nm and carbon particles from 0.6 to 10 μm were used for the classification experiments. Particle size distribution at the inlet and each minor flow were measured by SMPS for DOS particles and APS for carbon particles. Classification of airborne particles with 3 cut-off diameters is successfully demonstrated. The measured cut-off diameters were 135 nm, 1.9 μm, and 4.8 μm.

Original languageEnglish
Title of host publicationProceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
Pages619-622
Number of pages4
Publication statusPublished - 2007
Event20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan
Duration: 2007 Jan 212007 Jan 25

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
Country/TerritoryJapan
CityKobe
Period07/1/2107/1/25

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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