Abstract
A microtechnology for synthetic biodegradable polymers has been developed to fabricate three-dimensionally (3-D) shaped and microstructured multilayer constructs for biomedical applications. A unique micromolding method is proposed to create deep and interconnecting microstructures which facilitate cellular scale interconnection across the layers for cell-to-cell communication and the supply of nutrients and oxygen. A geometrical condition and molding setup for interconnecting microstructuring are described and demonstrated experimentally. Furthermore, various types of synthetic biodegradable polymers are explored and compared with regard to the behavior during the proposed process. Considering the thermal instability of synthetic biodegradable polymers, it is also confirmed that the proposed process does not affect the property of the polymers. Finally, microfabricated 3-D multilayer constructs is presented to demonstrate the feasibility of the technology as a unique scaffolding method.
Original language | English |
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Pages (from-to) | 1457-1465 |
Number of pages | 9 |
Journal | Journal of Microelectromechanical Systems |
Volume | 15 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2006 Dec |
Bibliographical note
Funding Information:Manuscript received June 25, 2005; revised December 14, 2005. This work was supported by Ethicon Inc., Johnson and Johnson Company. Subject Editor K. Böhringer. W. Ryu, R. J. Fasching, and F. B. Prinz are with the Rapid Prototyping Laboratory, Stanford University, Stanford, CA 94305 USA (e-mail: whryu@stanford.edu). M. Vyakarnam is with the Center for Biomaterials and Advanced Technologies, a division of Ethicon Inc., Johnson and Johnson Company, Somerville, NJ 08876, USA (e-mail: MVyakarn@ETHUS.JNJ.com). R. S. Greco is with the Surgery Department, School of Medicine, Stanford University, Stanford, CA 94305 USA (e-mail: grecors@stanford.edu). Digital Object Identifier 10.1109/JMEMS.2006.883566
All Science Journal Classification (ASJC) codes
- Mechanical Engineering
- Electrical and Electronic Engineering