TY - GEN
T1 - Metal nanodot array fabrication using self-assembled diblock copolymer
AU - Kim, S. J.
AU - Maeng, W. J.
AU - Park, D. H.
AU - Sohn, B. H.
AU - Kim, H.
PY - 2006
Y1 - 2006
N2 - By combining PS-PMMA self-assembled diblock copolymer (BC) and lift off process, gold nanodot array was fabricated. For surface neutralization, a novel method using conventional self assembled monolayer (SAM), MPTS (3-(p-methoxyphenyl)propyltrichlro-silane) was used. Surface treatment with SAM was analyzed by contact angle measurement and XPS. Upon the fabricated cylindrical nanohole array, gold was evaporated and 10 nm size gold nanoparticle array was fabricated by lift-off process.
AB - By combining PS-PMMA self-assembled diblock copolymer (BC) and lift off process, gold nanodot array was fabricated. For surface neutralization, a novel method using conventional self assembled monolayer (SAM), MPTS (3-(p-methoxyphenyl)propyltrichlro-silane) was used. Surface treatment with SAM was analyzed by contact angle measurement and XPS. Upon the fabricated cylindrical nanohole array, gold was evaporated and 10 nm size gold nanoparticle array was fabricated by lift-off process.
KW - Diblock copolymer
KW - Nanodot
KW - Self-assembled monolayer
UR - http://www.scopus.com/inward/record.url?scp=50249169286&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50249169286&partnerID=8YFLogxK
U2 - 10.1109/NMDC.2006.4388830
DO - 10.1109/NMDC.2006.4388830
M3 - Conference contribution
AN - SCOPUS:50249169286
SN - 1424405408
SN - 9781424405404
T3 - 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
SP - 488
EP - 489
BT - 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
T2 - 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
Y2 - 22 October 2006 through 25 October 2006
ER -