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Mechanically stable copolyimide for low level stress buffer
H. Chung, J. Lee, J. Hwang,
H. Han
Department of Chemical and Biomolecular Engineering
Research output
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Contribution to journal
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Article
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peer-review
21
Citations (Scopus)
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Dive into the research topics of 'Mechanically stable copolyimide for low level stress buffer'. Together they form a unique fingerprint.
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Physics
Stress Relaxation
100%
Water
37%
Utilization
25%
Plane
25%
Ratios
25%
Coefficients
25%
Thin Films
12%
Dielectrics
12%
Strength of Materials
12%
Thermal Expansion
12%
Sorption
12%
Moisture Content
12%
Increasing
12%
Mobility
12%
Material Science
Residual Stress
75%
Polyphenylene
25%
Liquid Films
25%
Thin Films
12%
Dielectric Material
12%
Polyimide
12%
Mechanical Property
12%
Physical Property
12%
Thermal Expansion
12%